Fully Automatic Thick Wire Wedge Bonder for Power Electronics
BJ955、BJ959、BJ985
Providing optimal and high-quality bonds that correspond to high currents.
In the field of power electronics, reliable bonding is required to safely and efficiently transmit high currents. Particularly in applications that demand high output, such as EV battery modules and power modules, secure bonding using thick wires or ribbons is essential. Insufficient bonding can lead to heat generation, performance degradation, and even failure. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 address these challenges and achieve stable bonding. 【Application Scenarios】 - EV/HEV battery modules - Power modules - Inverters - Motors 【Benefits of Implementation】 - Reliable bonding that accommodates high currents - Maintenance of product performance and increased longevity - Improved production efficiency
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basic information
【Features】 - Bond head compatible with a wide range of wire sizes from 50μm to 600μm (supports aluminum, copper, and aluminum-copper clad) - Supports ribbon bonding (up to 2,000μm x 400μm) - Optimized and high-speed image recognition system - Bond tool calibration without the need for fixtures - Fully automatic load calibration - High-precision programmable bond force actuator 【Our Strengths】 Hesse Mechatronics Japan Co., Ltd. is a 100% subsidiary of Hesse GmbH based in Germany, developing, manufacturing, and selling fine and heavy wire wedge bonders, ball bonders, ultrasonic welding machines, laser welding machines, and more. We have a track record of over 400 units delivered in Japan (including deliveries to overseas factories of Japanese customers) and provide customer-oriented support from the development stage to mass production. We also have numerous achievements with welding machines for EV/HEV battery modules and power modules, enabling us to meet various bonding needs in a one-stop manner.
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Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
