Providing the ideal bond for manufacturing high-sensitivity sensors.
In the manufacturing of high-sensitivity sensors, precise bonding is required to accurately capture fine signals. Particularly, to maximize the performance of the sensor, it is crucial to eliminate minute misalignments and contact failures in wire bonding as much as possible. Improper bonding can lead to increased noise and signal attenuation, potentially resulting in decreased sensitivity of the sensor. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 achieve reliable bonding necessary for the production of high-sensitivity sensors through high-precision image recognition and stable bonding force. 【Application Scenarios】 - Manufacturing line for high-sensitivity sensors - Bonding of electronic components requiring fine signal transmission - Product development where quality stability is important 【Benefits of Implementation】 - Reduced risk of sensor sensitivity decline - Improved product reliability - Achieving stable productivity
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【Features】 ■ Bond head: Compatible with aluminum, copper, and aluminum-copper clad from 50um to 600um, ribbon up to 2,000um x 400um ■ Optimized and accelerated image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ Fully automatic load calibration ■ High-precision programmable bond force actuator 【Our Strengths】 Hesse Mechatronics Japan Co., Ltd. is a 100% subsidiary of Hesse GmbH based in Germany, developing, manufacturing, and selling wedge bonders, ball bonders, ultrasonic welding machines, and laser welding machines for fine wires, thick wires, and ribbons. We have a track record of over 400 units delivered within Japan and provide customer support from the development stage to mass production. We are capable of addressing all inquiries related to wire bonding.
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Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
