Fully Automatic Thick Wire Wedge Bonder for Communication Equipment
BJ955、BJ959、BJ985
Providing optimal and high-quality bonds that support high-speed transmission.
In the telecommunications equipment industry, reliable bonding technology is required to achieve high-speed and stable signal transmission. Particularly in components that handle high-frequency signals, the quality of fine connections directly affects communication speed and stability. Improper bonding can lead to signal attenuation and noise generation, potentially resulting in decreased communication performance. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 address these challenges and provide high-quality bonds. 【Application Scenarios】 - Manufacturing high-speed communication modules - Wiring for high-density mounted circuit boards - Bonding of RF components 【Benefits of Implementation】 - Improved high-speed transmission performance - Stabilization of signal quality - Enhanced product reliability
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basic information
【Features】 - Bond head capable of handling a wide range of wire sizes from 50μm to 600μm (compatible with aluminum, copper, aluminum-copper clad, ribbon up to 2,000μm x 400μm) - Improved wire handling with reduced distance between the bond head and spool - Optimized and accelerated image recognition with a new digital camera and flashlight - Bond tool calibration without the need for fixtures - Fully automatic load calibration - High-precision programmable bond force actuator 【Our Strengths】 Hesse Mechatronics Japan Co., Ltd. is a 100% subsidiary of Hesse GmbH based in Germany, developing, manufacturing, and selling wedge bonders, ball bonders, ultrasonic welding machines, and laser welding machines for fine wires, thick wires, and ribbons. We have a track record of over 400 units delivered within Japan and support our customers from the development stage to mass production. Please feel free to consult us regarding wire bonding, regardless of the type of wire material. We also offer one-stop bonding solutions combined with ultrasonic and laser welding machines that have proven results in applications such as battery modules for BEV/HEV.
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Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
