Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
The high-speed fully automatic dual-head wedge bonder Bondjet BJ931 meets the latest technologies and various demands for automotive products and power semiconductors. It supports aluminum wire, copper wire, gold wire, and ribbon, and the bond head can be replaced in just a few minutes. With a robust and clean design, the industry's largest bonding area, long maintenance intervals, user-friendly software, and support features, the Bondjet BJ931 can also be equipped with Hesse Mechatronics' industry-leading process monitoring system PiQC.
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basic information
- Adoption of a linear motor on the XYZ bonder axis, achieving the highest UPH in the market. - Conveyance system using a linear motor (generally, conveyance time for TO-220 lead frames is under 100 msec). - Clean design provides easy access to equipment components. - High-rigidity frame design and sophisticated vibration suppression dampers achieve the highest robustness in the wedge bonder industry. - High-speed image capture system, state-of-the-art digital image processing, and strobe LED lights equipped.
Price range
Delivery Time
※Approximately 3.5 months
Applications/Examples of results
Power discrete, TO series, SOP, PQFN, Dip-IPM, and other lead frame compatibility has been demonstrated.
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Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
![[Customer Case] Die Bonder Supporting Stacking Implementation of Membrane Chips](https://image.mono.ipros.com/public/product/image/f38/2000625203/IPROS71322913749513752980.png?w=280&h=280)
