Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
Introducing the PowerFusion wedge bonder manufactured by K&S, handled by Techno Alpha. PowerFusion is a fully automatic wedge bonder for lead frame package devices, featuring the latest beltless direct drive motion system and a high-performance image recognition system, significantly improving productivity (UPH) and reliability compared to conventional models. Additionally, it offers a bond head configuration ranging from a single head type to a maximum of six heads, allowing for high productivity tailored to application needs and enabling line changes as necessary. 【Features】 <Productivity> - UPH increase: Adoption of direct drive servo system and high-speed image recognition system - MTBA increase: Enhanced uptime due to high-performance image recognition system <Performance> - Customizable loop profile - Improved bond position repeatability - Reduced damage to lead frames through the use of an input kicker with adjustable overload settings <Advanced Package Compatibility> - Support for small power devices - Expanded bond area - Improved indexing accuracy
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basic information
【Other Features】 <Usability> ■ Image verification function for devices after bonding ■ Bonding tool exchange without setup gauge ■ Global parameter settings that can be shared across multiple programs <Flexibility of Equipment Configuration> ■ Connection of single head and dual head ■ Switching between thick wire, thin wire, and thick ribbon ■ Up to 4 non-destructive hook-type pull testers/bond stages can be installed <Maintenance and Reliability> ■ Reduction of regular maintenance items for major components ■ Adoption of the latest direct drive for all XYZT bond head motion axes, eliminating drive belts and ball screws ■ Increased equipment reliability by reducing the number of wiring and connectors The aluminum wire wedge wire bonder PowwerFusion comes in TL and HL models. The TL model is optimal for TO-XXX series power devices in single to four-column matrices. The HL model is ideal for high-end, high-density power device packages that require high-precision bonding. The TL model can be converted to the HL model when support for advanced power devices becomes necessary.
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Applications/Examples of results
Various lead frame packages, devices, power devices, sensors, etc. *For more details, please refer to the PDF document or feel free to contact us.*
Line up（2）
| Model number | overview |
|---|---|
| TL Model | The TL Model is the optimal model for TO-XXX series power devices with single to four-row matrices. It achieves reduced manufacturing costs, the construction of optimal pattern recognition, and excellent bonding properties with high productivity. The TL Model can be converted to the HL Model when support for advanced power devices is required. |
| HL Model | The HL Model is the optimal model for thick wire, thin wire, and thick ribbon for advanced power devices. It meets the high precision indexing and high clamping force required for high-density packages such as SO-8, PDFN, and D-Pak. |
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Company information
Our mission at Techno Alpha is to "shine a light on Japanese manufacturing" by creating overwhelming added value. To achieve this, we have set our vision as "the best technology trading company in Japan" and are committed to realizing it. Techno Alpha is a team composed of members with technical backgrounds, including sales, service, mechanical design, electrical design, and software development. Our strength lies in our ability to solve problems from the same perspective and in the same language as our customers, enabling us to provide rapid access to the latest technologies. In this team, we strive to discover cutting-edge technologies from around the world, introduce them domestically, and develop what does not yet exist in the market ourselves. By quickly uncovering the world's leading technologies and developing what is not available, we can support the entire manufacturing industry in Japan. Our team upholds the value of "connecting with the world, honing our technology, and challenging the future," and we will continue to refine our ability to discover products, design and develop, and provide technical services, all in pursuit of creating overwhelming added value that will impress our customers.
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