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  1. Home
  2. Industrial Machinery
  3. ヘッセ・メカトロニクス・ジャパン
Industrial Machinery
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ヘッセ・メカトロニクス・ジャパン

EstablishmentJanuary 2014
capital300Ten thousand
number of employees5
addressTokyo/Koto-ku/1-9-6 Horidome-cho, Nihonbashi, Horidome General Building 1st Floor
phone03-6264-8686
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last updated:Nov 28, 2025
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  • Products/Services(4)
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ヘッセ・メカトロニクス・ジャパン Company Overview

Wire bonding expert; a wedge bonder for fine and heavy wires that integrates advanced technology.

Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.

Business Activities

We develop and sell equipment for assembly processes, ranging from fine and heavy wire wedge bonders, ultrasonic flip chip bonders, to custom-designed devices and integrated lines. We have cultivated the skills to satisfy our customers' demands, apply innovative power, and utilize cutting-edge technology up to today. As a leading supplier, we provide high-speed fully automatic fine wire wedge bonders and heavy wire bonders to the semiconductor industry, including power devices, automotive, aerospace, high frequency, microwave, optoelectronics, military, home appliances, and mobile devices.

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Products/Services (4)

Fully Automatic Thick Wire Bonder 'BJ955/959' product image
Fully Automatic Thick Wire Bonder 'BJ955/959'
High-speed fully automatic fine wire bonder 'BJ855' product image
High-speed fully automatic fine wire bonder 'BJ855'
Manual and Automatic Bonding Device 'BJ653' product image
Manual and Automatic Bonding Device 'BJ653'
BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport product image
BJ931 High-Speed Fully Automatic Wedge Bonder with Lead Frame Transport

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catalog(5)

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BJ931 Catalog

BJ931 Catalog

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BJ855/BJ885 Ball Bonding Catalog

BJ855/BJ885 Ball Bonding Catalog

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BJ855/BJ885 Catalog

BJ855/BJ885 Catalog

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BJ653 Catalog

BJ653 Catalog

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Detailed information

Company name ヘッセ・メカトロニクス・ジャパン
number of employees5
Contact addresspostalcode 135-0063 Tokyo/ Koto-ku/ 1-9-6 Horidome-cho, Nihonbashi, Horidome General Building 1st FloorView on map TEL:03-6264-8686
Industry Industrial Machinery

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