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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Bonding Equipment
  6. Fully Automatic Thick Wire Bonder 'BJ955/959'

Fully Automatic Thick Wire Bonder 'BJ955/959'

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last updated:Aug 17, 2021

ヘッセ・メカトロニクス・ジャパン
ヘッセ・メカトロニクス・ジャパン
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A controllable current transducer and frequency that continuously monitors wire deformation.

The "BJ955/959" is a fully automatic thick wire wedge bonder developed for various substrates, chips, lead frames, and other products. It is possible to build a system for fully automatic or manual operation. We offer bond heads that can handle a wide range of wire sizes from 50um to 600um. 【Features (partial)】 ■ Bond head: Compatible with 50um - 600um aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ High-precision programmable bond force actuator *For more details, please refer to the PDF materials or feel free to contact us.

    Bonding Equipment
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Fully Automatic Thick Wire Bonder 'BJ955/959'

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  • Related Link - https://www.hesse-mechatronics.com/produkte/dickdr…

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【Other Features (Partial)】 ■ Hesse Assist Tool (Optional) - E-Box: Visual bond head adjustment support (patented) - Position adjustment marks for tools and wire clamps - Automatic bond load calibration: Avoids operator errors by using load cells - Bond tool detection function - Wire spool detection ■ Detailed loop programming configurable for each individual loop ■ Use of wear-free components with piezo technology ■ Maintenance-free solid-state joints ■ Initial setting of bond head with EEPROM *For more details, please refer to the PDF document or feel free to contact us.

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Fully Automatic Thick Wire Bonder 'BJ955/959'

Fully Automatic Thick Wire Bonder 'BJ955/959'

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ヘッセ・メカトロニクス・ジャパン

ヘッセ・メカトロニクス・ジャパン

Industrial Machinery

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Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.

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