This is a thick line wedge bonder that can be utilized in prototype development scenes with its light footwork and excellent operability.
The "Thick Wire Semi-Auto HB30" is a newly added compact and low-cost desktop prototype machine specifically designed for thick wire, featuring excellent operability for power modules. It is ideal for the prototype development and small-scale production of thick wires. Its features include automatic height setting, loop profile functionality, profile modification and saving via touch panel operation, and the agility characteristic of a desktop machine. 【Features】 ■ Dedicated to thick wire ■ Compact ■ Low-cost ■ Excellent operability ■ Suitable for prototype development and small-scale production of thick wires *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Other Features】 ■ Automatic height adjustment is possible ■ Profile changes and saving can be done via touch panel operation ■ Lightweight and agile ■ High functionality ■ Loop shape control *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Leave manual wire bonders, ball bonders, and wedge bonders to TPT Japan. With excellent cost performance and a durable form, we respond flexibly to customization, making them more functional and versatile.
![Deburring Machine "Twin Baritor" [Eligible for Small and Medium Enterprise Productivity Investment Subsidy]](https://image.mono.ipros.com/public/product/image/6d3/2000308654/IPROS16685940644635288329.png?w=280&h=280)
