TPTジャパン Product Lineup

TPT Japan Co., Ltd. handles "Capillary." We offer various products including "Capillary for gold wire," which enables long life and high bonding strength, as well as the ultra-high density "GFC" developed for copper wire, and the high density and hardness "OPTIMA." You can choose according to your needs. 【Product Lineup】 ■ Capillary for gold wire ■ GFC for gold/copper wire ■ OPTIMA for copper wire *For more details, please refer to the PDF document or feel free to contact us.

• others

The "Thick Wire Semi-Auto HB30" is a newly added compact and low-cost desktop prototype machine specifically designed for thick wire, featuring excellent operability for power modules. It is ideal for the prototype development and small-scale production of thick wires. Its features include automatic height setting, loop profile functionality, profile modification and saving via touch panel operation, and the agility characteristic of a desktop machine. 【Features】 ■ Dedicated to thick wire ■ Compact ■ Low-cost ■ Excellent operability ■ Suitable for prototype development and small-scale production of thick wires *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

The "Full Manual HB05" is a full manual type tabletop wedge-ball combined wire bonder that prioritizes cost above all else. It features a liquid crystal display, with the bond profile shown digitally, and can store up to 20 programs in memory. Additionally, the wire feed function and movable clamp make wire handling tasks easy. 【Features】 ■ Focused on price with minimal functions ■ Suitable for simple wiring tasks ■ Ideal for prototype development with both wedge bond and ball bond capabilities ■ Excellent cost performance ■ Easy operation with liquid crystal display and wire feed function *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

The "Manual HB10" is a manual-type tabletop wedge-ball hybrid wire bonder that retains the excellent features of the "HB16" while considering price aspects. The Z-axis is motor-controlled, allowing for consistent control of loop height. The user interface features a 6.5-inch touch panel, enabling smooth changes and saving/loading of parameters. Additionally, the work surface is equipped with a sliding clamp and wire feed function, significantly reducing wire handling tasks and providing excellent operability. 【Features】 ■ Suitable for prototype development with both wedge bond and ball bond capabilities ■ Z-axis control for loop height management ■ Excellent operability with touch panel and wire feed function ■ Comprehensive features and stable bonding ■ Significant reduction in wire handling tasks *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

This is a comprehensive catalog featuring a wide variety of tabletop wire bonders from TPT, ideal for research and development with high-precision bonding and excellent operability. With this single unit, both wedge bonding and ball bonding are possible. We also offer various bonding tools such as capillaries and wedge tools. Please feel free to consult us for sample requests or tool selection. 【Featured Products】(Partial Introduction) ○ Tabletop Wire Bonder → Semi-auto / Manual / Full Manual / Wedge for Thick Wire ○ Bonding Tools → YAG Laser Thin Film Processing System → Photon Emission Microscope System and more For further details, please download the catalog or contact us.

• Bonding Equipment
• Other semiconductor manufacturing equipment

The TPT company's tabletop wire bonder is an ideal tabletop wire bonder for prototype development and rework, capable of wedge (ribbon) and ball bond (bump) with just a tool change. With the loop profile function controlled by Y and Z axis motors, it enables high-precision bonding in loop shapes such as reverse and low loops. Additionally, the wire feed function significantly reduces wire handling tasks, and the adoption of a touch panel allows for efficient profile editing. Other options include the manual type HB10 series (Z axis motor control) and the fully manual HB05 series.

• Bonding Equipment