Tabletop Wire Bonder HB16
The TPT company's tabletop wire bonder is an ideal tabletop wire bonder for prototype development and rework, capable of wedge (ribbon) and ball bond (bump) with just a tool change. With the loop profile function controlled by Y and Z axis motors, it enables high-precision bonding in loop shapes such as reverse and low loops. Additionally, the wire feed function significantly reduces wire handling tasks, and the adoption of a touch panel allows for efficient profile editing. Other options include the manual type HB10 series (Z axis motor control) and the fully manual HB05 series.
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basic information
The TPT company's tabletop wire bonder is an ideal tabletop wire bonder for prototype development and rework, capable of wedge (ribbon) and ball bond (bump) with just a tool change. With the loop profile function controlled by Y and Z axis motors, it enables high-precision bonding in various loop shapes such as reverse and low loops. Additionally, the wire feed function significantly reduces wire handling tasks, and the use of a touch panel allows for efficient profile editing. Other options include the manual type HB10 series (Z-axis motor control) and the fully manual HB05 series.
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Applications/Examples of results
We have delivered numerous products for prototype development and small-scale production to manufacturers related to semiconductors and substrates. Our products can be used for both wedge and ball bonding, making them versatile, and their ease of operation allows anyone to achieve high-precision bonding.
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Company information
Leave manual wire bonders, ball bonders, and wedge bonders to TPT Japan. With excellent cost performance and a durable form, we respond flexibly to customization, making them more functional and versatile.
