Capable of supporting small-lot production of multiple varieties, contributing to increased productivity.
Fine pitch, stacked IC Fully automatic wire bonder compatible with all cutting-edge devices.
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basic information
【Features】 ○ Ultra-fast bonding: 58 milliseconds/wire ○ Fine pitch compatible: 35μm ○ Various loop modes available ○ High variety compatibility Operable without part replacement for wire diameters of 15 to 75μm ○ New graphic user interface ● For other functions and details, please download the catalog.
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Company information
Kaijo has been providing total ultrasonic solutions globally that fit customer needs by incorporating cutting-edge electronics/mechatronics technology based on the ultrasonic technology cultivated since its founding in 1948. The ODM division aims to enable a wider range of customers to utilize these foundational technologies more than ever before. - Contract development (ODM) is available from a single unit. - We manufacture transducers and oscillators tailored to customer requests. - We have experimental and evaluation facilities equipped with clean rooms, providing a robust evaluation environment for prototypes. - Some rental units are also available, allowing customers to evaluate before placing an order. - Our Matsumoto facility (Nagano Prefecture) has a manufacturing line registered for medical device manufacturing and has obtained ISO13485 certification. ■ Contact phone (direct) 042-555-2398 ■ Contact email odm-info(at)kaijo.co.jp <Please change (at) to @>
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