Achieve high productivity with UPH25000!
Wire bond for discrete and small pin applications that meets the demands for diverse packaging and fine pad pitch.
Inquire About This Product
basic information
◆◇◆ Features ◆◇◆ ◆ High-speed bonding: 54 milliseconds/wire With loop control; wire length 0.5mm ◆ Pad opening compatibility: 35μm ◆ Equipped with various loop modes ◆ High variety compatibility: Operates without part replacement for gold wire diameters of 15 to 75μm ◆ New graphic user interface ◆ For other functions and details, please download the catalog or contact us.
Price information
-
Delivery Time
Applications/Examples of results
For more details, please contact us.
Company information
Kaijo has been providing total ultrasonic solutions globally that fit customer needs by incorporating cutting-edge electronics/mechatronics technology based on the ultrasonic technology cultivated since its founding in 1948. The ODM division aims to enable a wider range of customers to utilize these foundational technologies more than ever before. - Contract development (ODM) is available from a single unit. - We manufacture transducers and oscillators tailored to customer requests. - We have experimental and evaluation facilities equipped with clean rooms, providing a robust evaluation environment for prototypes. - Some rental units are also available, allowing customers to evaluate before placing an order. - Our Matsumoto facility (Nagano Prefecture) has a manufacturing line registered for medical device manufacturing and has obtained ISO13485 certification. ■ Contact phone (direct) 042-555-2398 ■ Contact email odm-info(at)kaijo.co.jp <Please change (at) to @>
![Deburring Machine "Twin Baritor" [Eligible for Small and Medium Enterprise Productivity Investment Subsidy]](https://image.mono.ipros.com/public/product/image/6d3/2000308654/IPROS16685940644635288329.png?w=280&h=280)
