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  6. Semiconductor assembly device Wire bonder FB-880

Semiconductor assembly device Wire bonder FB-880

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Wire Bonder FB-880

last updated:Oct 01, 2010

カイジョー
カイジョー
  • Official site

Realizing joining technology for new fields

Operator-friendly, stable, full-auto wire bonder.

    Other semiconductor manufacturing equipment
16.jpg

Semiconductor assembly device Wire bonder FB-880

16.jpg
16.jpg
  • Related Link - http://www.kaijo.co.jp/bonder/index.html

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basic information

【Features】 ○ Equipped with a dual-frequency ultrasonic transducer ○ Adoption of a new electric torch system ○ Adoption of a new ultrasonic system ○ New operating system centered around a mouse ○ Support functions compatible with complex varieties ○ Standard equipped with HSMS ● For other functions and details, please download the catalog.

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カイジョー

カイジョー

Industrial Electrical Equipment

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Kaijo has been providing total ultrasonic solutions globally that fit customer needs by incorporating cutting-edge electronics/mechatronics technology based on the ultrasonic technology cultivated since its founding in 1948. The ODM division aims to enable a wider range of customers to utilize these foundational technologies more than ever before. - Contract development (ODM) is available from a single unit. - We manufacture transducers and oscillators tailored to customer requests. - We have experimental and evaluation facilities equipped with clean rooms, providing a robust evaluation environment for prototypes. - Some rental units are also available, allowing customers to evaluate before placing an order. - Our Matsumoto facility (Nagano Prefecture) has a manufacturing line registered for medical device manufacturing and has obtained ISO13485 certification. ■ Contact phone (direct) 042-555-2398 ■ Contact email odm-info(at)kaijo.co.jp <Please change (at) to @>

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