Significant improvements in recognition capabilities will contribute to the increased operational efficiency of the production line.
- Expanded the bonding area in the Y direction by 70mm, enabling support for wide bonding. - Integrated two heads to achieve space-saving. - Capable of accommodating various wire diameters through kit replacement.
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basic information
- Supports not only general discrete products such as TO-220 and 3P series, but also high-density frames and irregular frames for matrix specification discrete frames, power devices, and power modules, as well as cutting-edge packages. - Achieves approximately 24% space savings with a two-head integrated design. - Compatible with aluminum fine wire, medium wire, thick wire, ribbon, and copper wire. - With the bond replacement kit, bonding is possible with one bonder for aluminum fine wire of 25μ to copper thick wire of 500μ. - A single oscillator can support all oscillation frequencies in the lineup of 80kHz, 110kHz, and 120kHz. - Further speed enhancement is achieved with multi-point simultaneous recognition functionality. - Operation via a touch panel is possible (joystick operation is optional).
Price range
P7
Delivery Time
Applications/Examples of results
- TO-220, 3P series and other general-purpose discrete products - High-density frame packages for matrix specification discrete frames, power devices, power modules, etc.
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Company information
Since our founding, we at Ultrasonic Industry have been engaged in technology-driven management by combining our core ultrasonic technology with electronics and, further, mechatronics technology. We have received generous evaluations of our technological and product development capabilities from many, and we sincerely thank you for your support. In today's market, which is diversifying and where product life cycles are becoming increasingly shorter, what is required of companies is high development capability and rapid responsiveness born from flexible thinking. To provide products with high performance at low cost, we will further enhance our internal and external networks and aim to be a nimble company. Moreover, Ultrasonic Industry will play its role as a leading company in the industry in the highly information-oriented era of the 21st century, enhancing the development and technical capabilities we have cultivated thus far, and further refining our creativity by leveraging the individuality of each employee as we move forward with renewed determination. In the future, we will actively expand our business in the semiconductor manufacturing sector, industrial equipment sector, and measurement equipment sector, while flexibly responding to the needs and seeds of society, and we are committed to contributing to the creation of a prosperous society. We sincerely ask for your continued guidance and support.
