Expansion of productivity! The large work area allows for batch processing of multiple devices.
The "BJ855" is a next-generation fully automatic fine wire bonder that expands the portfolio of existing production processes. It meets the growing demands for wire bonding and offers simplified operations through smart features such as bond head memory and chip libraries. In addition to standard equipment configurations, it is possible to provide automated transport systems optimized for individual devices. 【Features (partial)】 ■ High-performance touchdown detection with no detection delay, suitable for bonding thin substrates ■ Optimized image recognition: imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ Detailed loop programming configurable for each individual loop ■ Use of wear-free components with piezo technology *For more details, please refer to the PDF materials or feel free to contact us.
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【Other Features (Partial)】 ■ Hesse Assist Tool (Optional): - E-Box: Visual bond head adjustment support (patented) - Position adjustment marks for tools and wire clamps - Automatic bond load calibration: Avoids operator errors by using load cells - Bond tool detection function ■ Maintenance-free solid-state joint ■ Initial setting of bond head with EEPROM *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.