Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.
iBond5000 is a bonding device designed based on the K&S 4500 series, which has a proven track record of leading the market for over 10 years and features an advanced graphic user interface.
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basic information
【Ball】 Ball bonding: Bumping, Coining, Security Bond, Tab compatible Compatible wire types: Gold wire, Copper wire (Cu kit option) 【Wedge】 Bonding types: Wedge, Tab, Stitch, Ribbon Compatible wire types: Aluminum wire, Gold wire, Ribbon, and Copper wire 【Dual】 Bonding types: Wedge, Tab, Stitch, Ribbon, Bump, Ball Coining, Security Bond Compatible wire types: Gold wire, Copper wire (Wedge ball), Aluminum wire, Ribbon (Gold, Copper)
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Since its founding, MPP has over 40 years of experience and know-how, and is used in a wide range of fields including microelectronics, medical, military, and aerospace, supplying products to over 400 customers in 20 countries.
Company information
Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.
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