Fully Automatic Thick Wire Wedge Bonder for LED Lighting
BJ955、BJ959、BJ985
Providing the optimal bond for high-brightness LED manufacturing.
In the manufacturing of high-brightness LED lighting, reliable electrical connections are directly linked to product performance. In particular, for thick wire bonding that handles large currents, secure bonding is essential, as it affects the brightness and lifespan of the LED. Inadequate bonding can lead to heat generation and performance degradation. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 accommodate a wide range of wire sizes and achieve stable bonding, contributing to the maintenance of high-brightness LED quality. 【Application Scenarios】 - Connection of high-brightness LED chips to lead frames - Manufacturing of LED modules for large current applications - Mass production lines for LED lighting products 【Benefits of Implementation】 - Reduced risk of LED brightness degradation - Improved product reliability - Enhanced production efficiency
Inquire About This Product
basic information
【Features】 ■ Bond Head: Compatible with aluminum, copper, and aluminum-copper clad from 50um to 600um, ribbon up to 2,000um x 400um ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized and accelerated image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ Fully automatic load calibration ■ High-precision programmable bond force actuator 【Our Strengths】 Hesse Mechatronics Japan Co., Ltd. is a 100% subsidiary of Hesse GmbH based in Germany, developing, manufacturing, and selling wedge bonders, ball bonders, ultrasonic welders, and laser welders for fine wires, thick wires, and ribbons. We have a track record of over 400 units delivered in Japan and support our customers from the development stage to mass production. For inquiries regarding wire bonding, whether it be aluminum, gold, copper, clad, or other wire materials, please feel free to contact us. Together with our ultrasonic and laser welders, which have proven results in battery modules for BEV and HEV, we can meet various bonding needs in a one-stop solution.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
