Heat-resistant up to 927°C! Ideal for bonding electronic components and high vacuum parts! A heat-resistant adhesive with excellent conductivity.
"Pyroduct 597-A" is a heat-resistant adhesive enhanced with silver particles for improved conductivity. It is ideal for bonding electronic components and high vacuum parts where stability and adhesion are required! With silver as a filler, it has a resistivity of 0.0002 Ω·cm. Using an inorganic binder, it excels in weather resistance and heat resistance compared to organic adhesives. Additionally, it does not emit outgassing after firing, making it usable in a vacuum. It is a water-based, one-component silver paste. If you need to reduce viscosity, please use the dedicated thinner 597-A-T. [Capacity: 25g, 50g] *For detailed specifications, please refer to the catalog or feel free to contact us.
Inquire About This Product
basic information
【Features】 - The maximum heat resistance is 927°C, and the resistivity at room temperature is 0.0002 ohm-cm. - Uses an inorganic binder, which offers superior weather resistance and heat resistance compared to organic adhesives. - A one-component type that can be stored at room temperature. - High-purity silver particles are mixed with a conductive binder to enhance heat resistance. - Excellent electrical and thermal conductivity, with electrical resistance significantly better than that of conventional non-conductive epoxy resin-based materials. - The electrical resistivity is 0.0002 ohm-cm at room temperature, and the tensile shear strength is 450 psi. - It is a one-component (paste-like) product that is water-dispersible and does not use organic resins or solvents. - The color is silver. - Minimum order quantity: 50 grams. → However, for testing purposes, it can be supplied starting from 25 grams.
Price information
Please feel free to contact us.
Delivery Time
Applications/Examples of results
【Examples of Use】 - Repair of printed circuit boards - Sensors used in high vacuum - High-temperature connectors and special light sources - Electromagnetic wave shield gaskets - Installation of thermal components - IC chips, semiconductor components, etc. 【Instructions for Use】 - Roughen the surfaces to be bonded or coated with shot blasting or sandpaper, and then thoroughly remove dust, oil, and residues from shot blasting and sandpaper using a cleaning agent before application. Be sure to mix the product well just before use to ensure uniformity, but mix slowly to avoid incorporating air. - After completing the bonding process, allow it to dry at room temperature for 1-2 hours, then cure at 93°C for 1-2 hours. - Items that have not been cured can be easily removed with warm water and soap.
catalog（5）
Download All Catalogs
Company information
Audeck Co., Ltd. was established on June 28, 1973, with the aim of importing, manufacturing, and selling industrial chemical products. In November 1988, the company partnered with the American heat-resistant adhesive manufacturer, Alembic Products, to sell their ceramic and heat-resistant epoxy adhesives and ceramic coatings in Japan. In the late 1980s, the company began selling heated black dye, and after 1986, developed new heated black dyeing equipment. Furthermore, in 2003, they launched an electroless nickel plating device, continuing to grow steadily.