It is possible to bond substrates and resin substrates coated with adhesive in a voidless manner for lamination in a vacuum.
The bonding device is a machine that joins wafers together using adhesives such as UV resin. It consists of a weighting and bonding chamber, an alignment mechanism, a bonding area inspection mechanism, and an angle deviation inspection mechanism. Additionally, it can be connected to a glove box for pre-treating substrates in an inert atmosphere. Depending on customer needs, it is possible to select the necessary functions from these mechanisms to configure the device. For more details, please download the catalog or contact us.
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【Products】 ○ Prototype VJ-35 → A prototype bonding device focused on weight and bonding functions in a vacuum. → It can flexibly accommodate changes in sample shapes, allowing for various types of bonding experiments. ○ Mass Production VJ-60A → A mass production bonding device using a cassette-to-cassette method. → Compatible with wafers up to 8 inches. ○ Mass Production VJ-60R → A mass production bonding device using a cassette-to-cassette method. → Equipped with alignment, bonding area inspection, and angle deviation inspection after bonding. ● For more details, please download the catalog or contact us.
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The roots of our technology lie in vacuum. In particular, vacuum sealing technology is a crucial final process that affects the quality of LSI and electronic components. Our vacuum sealing equipment has achieved this with high precision, low cost, and high yield, leading to its adoption by major semiconductor manufacturers and marking the beginning of high recognition for our technology.
