It can flexibly accommodate changes in sample shape, allowing for various types of bonding experiments, from those that do not use sealing materials to those that can be bonded at room temperature.
We have achieved wafer bonding that provides bulk fracture strength at room temperature. We cater to a range of bonding equipment from research and development to mass production. Our technology is used in a wide variety of fields, including wafer-level packaging and 3D integration. For development purposes, we offer a series of research-grade surface activation bonding devices, ranging from those with focused functions for activation treatment and bonding to those equipped with high-precision alignment and analysis capabilities. For mass production, we provide equipment designed for bonding substrates such as silicon and compound semiconductors after activating the bonding surfaces under ultra-high vacuum conditions. This process allows for bonding at room temperature without the use of sealing materials. For more details, please download the catalog or contact us.
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【Products】 ○ For Experimental Use → SAB-60RD1 A bonding device focused on surfactant activation and bonding for experimental use. → SAB-60RD3 A device centered on irradiation and bonding functions, with various optional mechanisms available for addition. ○ For Mass Production → SAB-60R Capable of transporting wafers in a vacuum, aligning them, and then bonding. → SAB-60S Equipped with a simple alignment function. ● For more details, please download the catalog or contact us.
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The roots of our technology lie in vacuum. In particular, vacuum sealing technology is a crucial final process that affects the quality of LSI and electronic components. Our vacuum sealing equipment has achieved this with high precision, low cost, and high yield, leading to its adoption by major semiconductor manufacturers and marking the beginning of high recognition for our technology.