Micro Contact Printer MP200

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last updated：Sep 24, 2012

ナノテック

Official site

The μCP method is attracting attention as a next-generation device manufacturing technology!

The Microcontact Printer MP200 is an experimental and research support device that corresponds to the μCP method (Microcontact Printing), which is gaining attention as a next-generation device fabrication technology. The μCP method utilizes PDMS stamps to not only pattern self-assembled monolayers (SAM) using thiol molecules but also to pattern functional materials such as organic semiconductor materials with higher precision than conventional printing methods. This has led to ongoing research and development as a fabrication technology for organic electronics and nano-bio devices. The MP200 significantly reduces defects that occur during fine patterning by adopting a bubble trapping prevention mechanism based on research results from AIST. The transfer process stage allows for programmable control of contact speed, contact pressure, distance, and time using high-precision pressure sensors and Z-axis servo control. The operation is intuitive and user-friendly, utilizing a touch panel and joystick. For more details, please contact us or refer to the catalog.

Related Link - http://www.nanotech-inc.co.jp/index.html

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【Features】 ○ Uses fluorescent color material rhodamine ink ○ Achieves fine transfer through non-self-organization ○ High-resolution wiring patterns are expected to be created through the transfer of conductive materials ○ Sample and stamp sizes support up to φ8 inches ○ High-precision overlay is possible with the auto-alignment function ○ High operability is achieved using a joystick and touch panel ○ Anti-foaming mechanism adopted → Significantly reduces defects that occur during fine pattern fabrication ○ Transfer process stage → Contact speed, contact pressure, distance, and time can be programmed and controlled with high-precision pressure sensors and Z-axis servo control ● For more details, please contact us or refer to the catalog.