The variations for heat dissipation measures will expand.
It is an adhesive thermal conductive material with high thermal conductivity and insulation reliability.
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basic information
We can manufacture heat dissipation substrates with a multilayer structure, allowing for the establishment of new thermal conduction pathways and increasing the flexibility of thermal management.
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Applications/Examples of results
A structural material that connects a substrate equipped with heat-generating components such as high-brightness LEDs and power semiconductors to a heat dissipation plate (heat sink).
Line up（1）
| Model number | overview |
|---|---|
| E-3245 | Thermal conductivity = 3.0 W/mK |
catalog（2）
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Company information
The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.