The variations for heat dissipation measures will expand.
It is an adhesive thermal conductive material with high thermal conductivity and insulation reliability.
Inquire About This Product
basic information
We can manufacture heat dissipation substrates with a multilayer structure, allowing for the establishment of new thermal conduction pathways and increasing the flexibility of thermal management.
Price range
Delivery Time
Applications/Examples of results
A structural material that connects a substrate equipped with heat-generating components such as high-brightness LEDs and power semiconductors to a heat dissipation plate (heat sink).
Line up（1）
| Model number | overview |
|---|---|
| E-3245 | Thermal conductivity = 3.0 W/mK |
catalog（2）
Download All Catalogs
Company information
The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.
![[Example] Improved cutting performance by preventing blade contamination.](https://image.mono.ipros.com/public/product/image/c4f/2000644218/IPROS54051186879549803023.jpeg?w=280&h=280)
![[Example] Non-stick surface on metal = tape and glue will not adhere.](https://image.mono.ipros.com/public/product/image/94c/2000644550/IPROS96990920943492969297.jpeg?w=280&h=280)
![[Example] Non-stick property on metal surfaces = Prevention of dirt on photomasks](https://image.mono.ipros.com/public/product/image/646/2000645091/IPROS20008530851421665238.jpeg?w=280&h=280)