Development of conductive pastes and inks, surface treatment, synthesis, and evaluation of metal nanoparticles.
AND006
- Low-temperature and room-temperature sintering of Ag-based materials - Cu-based antioxidant - Surface oxidation control - Dispersion stabilization - Conductivity improvement - Optimal adjustment methods according to various printing techniques
This book focuses on "conductive pastes, particularly copper and silver," and is an unparalleled resource that covers surface treatment, manufacturing, synthesis, evaluation as firing thin films, application development, and future markets specifically for paste materials specialized in copper (Cu) and silver (Ag). It highlights challenges with a particular emphasis on ink and paste technology, covering key points comprehensively. Additionally, it includes significant applications such as printed electronics and touch panel wiring materials, particularly focusing on antioxidant properties in copper paste and low-temperature sintering and low resistance in silver paste. This book encompasses specific surface treatment methods that are not found in other similar publications. It can be considered a cutting-edge technical book written by leading researchers in this field. I hope it serves as a guide for readers considering the development of conductive pastes and inks to create new products.
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★ How can we produce high-quality nanoparticles using dry and wet methods while reducing costs? What are the challenges to overcome in large-scale synthesis methods? ★ How can we prevent aggregation and achieve dispersion stabilization in aqueous solutions and organic solvents? What are the key points for surface treatment of fine particles? ★ How can we deactivate the protective layer on the particle surface using heat or chemicals and successfully perform sintering? What are the appropriate particle sizes and useful processing agents? ★ How can we ensure that the original performance is exhibited during the conductivity and sintering processes? How can we remove binders and dispersants? ★ What are the effects of copper and silver complexation? Approaches using thermal decomposition and reducing agent addition! ★ What are the challenges in producing particles with alloying and core-shell structures? What are the technical issues when using copper salts and silver salts as metal salts? ★ How can we form conductive paths to maintain quality as wiring materials? What is necking and its generation mechanism? What are the requirements for elongation and flexibility? ★ What are the challenges in adjusting viscosity for sintering in various atmospheres such as light sintering, and in inkjet, screen, gravure, and flexo printing technologies?
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Table of Contents Chapter 1: Conductive Paste and Ink - Surface Treatment, Synthesis, and Evaluation of Metal Nanoparticles Section 1: Technological Trends in Conductive Filler and Paste Technology Section 2: Surface Modification and Low-Temperature Copper Thin Film Synthesis by Controlling Surface Oxidation of Copper Nanoparticles Section 3: Novel Synthesis Processes for Copper Nanoparticles and Microparticles and Imparting Antioxidant Properties to Copper Particles Section 4: Synthesis Methods for Single Nanometer Sized Copper Nanoparticles Section 5: Low-Temperature Sintering of Silver Nanoparticles - Optimal Structural Control and Property Improvement Techniques for Copper Nanoparticles Section 6: Evaluation of Conductivity and Reliability and Performance Assessment as Coatings Section 7: Suppression of Ion Migration in Printed Silver Wiring Chapter 2: Design and Application Development of Conductive Paste and Ink in Latest Products Section 1: Nano Ink for Metal Wiring Section 2: Development of Room Temperature Printed Organic Devices Section 3: Design of Silver-Based Conductive Adhesives, Conductive Mechanisms, and Property Enhancement for Low-Temperature Sintering Section 4: Development and Application Technology of Low-Temperature Sinterable Metal Nanoparticle Ink and Paste Section 5: Silver Nanoparticle Technology that Eliminates the Need for Sintering Section 6: Application to Touch Panels Using Conductive Silver Paste Section 7: Water-Soluble Photo-Sinterable Cu Metal Ink for Printed Electronics
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