Infrared transmission micro via and trench inspection device for MEMS/TSV.

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last updated：Feb 13, 2020

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MEMS device inspection equipment (MEMS micro-hole depth measurement, pattern inspection)

As a MEMS device inspection system, we offer a fine hole depth measurement device and a pattern inspection device. The fine hole depth measurement device utilizes an infrared camera and a special algorithm to enable the measurement of the depth of non-through holes with a diameter of less than 20 μm, which is typically impossible to measure. The pattern inspection device is an automatic infrared image processing inspection system that uses an infrared microscope and an electric stage to automatically detect defects. It can save the position, size, and images of the defective areas, and is used for inspection purposes in MEMS (micro-machines). For more details, please contact us.

Related Link - http://www.disctech.co.jp/maikurosuko-punew1.htm

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【Features】 ○ Automation and quantification of microscope inspections that were previously done visually ○ Ability to save detected images ○ Inspection results can be displayed on a map ○ Image auto-focus ○ Defect detection software (with OK/NG judgment function) ○ Teaching playback operation → Repeats the stage operation that has been taught once ○ Uses an infrared camera, utilizing the principle that infrared light passes through silicon → Non-destructive testing is possible ● For more details, please contact us.