Detecting hard-to-find defects using processing to make low-contrast images easier to see.
The "IR-MEMS100" is a fully automated MEMS defect inspection device that automatically transports bonded wafers using robots, captures images of the internal state of the wafers with a specialized infrared optical system, and detects various defects using a defect detection algorithm. Images are captured with a high-sensitivity infrared camera set in an infrared microscope, and a proprietary defect detection software identifies hard-to-see defect areas. 【Features】 ■ Captures images with a high-sensitivity infrared camera set in an infrared microscope and detects hard-to-see defect areas using proprietary defect detection software. ■ Uses processing (effect processing) to enhance low-contrast images, making it easier to detect hard-to-find defect areas. ■ Compatible wafer sizes are 4 inches, 6 inches, and 8 inches. ■ Defect detection capability is approximately 10μm. ■ Inspection time is 30 minutes per wafer. *For more details, please refer to the PDF document or feel free to contact us.
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【Other Functions】 ■ Alignment mark misalignment ■ Automatic alignment function ■ Cassette-to-cassette capability ■ Automatic supply and discharge by robots ■ Defect verification on a desktop using offline software *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Detection of various defects *For more details, please refer to the PDF document or feel free to contact us.
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Disk Tech's image processing is provided by in-house optical engineers, laser engineers, hardware, software, and precision machinery engineers as a total solution. We handle inspection devices utilizing infrared technology, three-dimensional inspection devices, and more. Our proprietary infrared microscope has over 10 years of proven performance.
