This is an optimal CPU cooler for embedded use in FA and industrial equipment. It is a user-friendly CPU cooler for embedded applications.
This is a high-power CPU cooler compatible with Intel Socket LGA1156/1155/1150. It incorporates copper pillars into the heat sink core to efficiently absorb CPU heat and transfer it to the flower-shaped aluminum fins, allowing for radial heat dissipation. It is equipped with a large 90×90×25mm fan to ensure airflow, directing a substantial amount of air onto the heat sink for cooling. Additionally, the use of a thick heat sink increases heat dissipation, making it suitable for cooling CPUs with high TDP. (Model number: JYC9L06AGC-B)
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basic information
JYC9L06AGC-B ■ Top flow type for Intel Socket 1156/1155/1150 ■ Heat sink material: Core section copper column, fin section aluminum ■ Dimensions: 123.64(L) × 123.64(W) × 61.4(H) mm ■ Weight: Approximately 536g ■ Fan bearing structure: 2 ball bearings ■ Fan speed: 1000~4500 rpm ■ Fan airflow: 16.57~76.92 CFM ■ Mounting method: Spring screws + backplate
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Applications/Examples of results
For industrial PCs, FA equipment, etc., aimed at embedded CPUs.
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Company information
Nidec Corporation Authorized Dealer Taiwan CHIA CHERNE General Agent Taiwan SUNON Sales Agent Taiwan PRO-ARIES INDUSTRIES General Agent Tranyoung Technology Sales Agent Taiwan Thermal Transtech International General Agent
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