Total height 63.4mm, supports TDP 95W, CPU cooler with copper column and aluminum fins.
It can cool CPUs for Intel Socket LGA1700. 【Features】 ● CPU cooler for Intel Socket LGA1700. ● Height of 63.4mm, supports TDP of 95W. ● Heat sink consists of copper pillars and aluminum fan. ● The core part of the heat sink incorporates copper pillars to efficiently absorb the CPU's heat, transferring it to the flower-shaped aluminum fins for radial heat dissipation. The airflow is radial around the CPU, cooling nearby devices as well. ● The installation method uses a backplate, ensuring a secure fit and close contact with the CPU. There is no worry of it falling, allowing for safe transportation.
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basic information
Model number: JYCML118ATC ■ For Intel Socket LGA1700 ■ Heat sink material: Core part - copper column, Fin part - aluminum ■ Weight: 504g ■ Dimensions: 90mm (L) × 90mm (W) × 63.4mm (H) ■ Fan size: φ90mm 80mm × 80mm × 25mm ■ Fan bearing structure: 2 ball bearings ■ Fan speed: 1000 to 4500 rpm ■ Airflow: 17.79 to 80.06 CFM (0.50 to 2.27 m³/min) ■ Noise level: 22 to 50 dB
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Applications/Examples of results
Industrial PCs, space-saving devices for FA equipment, and embedded PCs. For more details, please contact us.
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Nidec Corporation Authorized Dealer Taiwan CHIA CHERNE General Agent Taiwan SUNON Sales Agent Taiwan PRO-ARIES INDUSTRIES General Agent Tranyoung Technology Sales Agent Taiwan Thermal Transtech International General Agent
