Ultra-precision polishing achieved through the use of a special material flat plate and carefully selected high-quality polishing abrasives.
The high-precision tabletop small wrapping machine NF-300 is a revolutionary device that maintains a low price while offering high performance and advanced features. With its unique wrapping technology, we have developed an automatic wrap flatness correction device at a low cost, making high-precision flat processing, specifically achieving flat finishes within sub-microns over larger areas, easier for everyone utilizing wrapping processing. Additionally, to accommodate the diversification of samples and materials, we have prepared various methods for sample mounting, specifically a "sample support mechanism," and we also offer a wide range of sample mounting jigs. For more details, please contact us or refer to the catalog.
Inquire About This Product
basic information
【Specifications】 ○ Lap plate: Diameter φ300 × Inner diameter φ100mm ○ Sample support unit mounting poles: 2 pieces (compatible with various sample support units) ○ Motor: AC100V single phase 50/60Hz 120W 3.8A ○ Lap plate rotation speed: 10rpm to 150rpm (with slow start and slow stop) ○ Rotation speed display: Digital display ○ Timer → Digital display → Minimum setting time: seconds → Range switchable → Remaining time/Elapsed time display selectable → Possible to stop during set time → Reset switch included ○ Auxiliary power supply → Timer-linked AC100V 2 outlets → Timer non-linked (with switch) AC100V 2 outlets → Emergency stop button included → Waste liquid hose ○ Required power supply: AC100V single phase 50/60Hz ○ Device dimensions: 400mm × 580mm × 620mmH (with dust cover) ○ Device weight: 30kg ● For more details, please contact us or refer to the catalog.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
For more details, please contact us or refer to the catalog.
catalog（1）
Download All Catalogs
Company information
In the development of new materials such as semiconductors, organic synthesis materials, optical materials, various ceramics, and electronic materials from conventional general materials, the observation of the fine structural organization of the materials is essential, and optical microscopy is conducted. To achieve this, sample preparation that faithfully represents the structural organization as much as possible is required. Our lapping/polishing technology aims to contribute to production that allows for sample polishing capable of observing fine details more faithfully than conventional methods, as well as high-precision mass production. The materials in the world are diverse and varied, each possessing unique characteristics, and to process them efficiently and easily, it is necessary to find the optimal process suited to each from a wide variety of factors. In other words, it is the "Know-How" of the processing process. If you are considering polishing for anything from small to large items, please feel free to contact us, including mechanical and C.M.P. We are committed to providing the best possible methods.