Can also cooperate in criminal investigations!
We can collaborate using underfill BGA rework technology. We can handle everything from the removal of underfill and coated components (such as BGA and CSP) to reballing, replacement, and reinstallation. The cured underfill material seals the BGA, significantly improving its strength compared to standard BGAs, and while its effectiveness is tremendous, the rework tasks such as removal or component replacement are more challenging than typical rework processes. At K-All, we have worked on methods and technical research to ensure that rework can be performed even on devices with various underfill materials applied. We can handle everything from component removal to reballing and replacement reinstallation. Rework and reballing are also possible for BGAs and CSPs that have undergone underfill and coating treatment. We can replace solder balls on BGAs and CSPs from lead-free to eutectic. We maintain over 5,000 types of masks for rework. ● For more details, please download the catalog or contact us.
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basic information
【Features】 ○ Supports everything from component removal to reballing and replacement reinstallation. ○ Rework and reballing are possible for BGA and CSP with underfill and coating treatment. ○ Solder balls of BGA and CSP can be replaced from lead-free to eutectic. ○ More than 5,000 types of partial masks for rework are available. ● For more details, please download the catalog or contact us.
Price information
For more details, please contact us.
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Applications/Examples of results
■Published in the Nikkan Kogyo Shimbun The underfill rework process at K-All has been featured in the Nikkan Kogyo Shimbun. Mobile phones that have been intentionally damaged (burned, thrown into rivers or seas, run over by cars, etc.) are deemed irreparable by manufacturers. In processes that apply the underfill rework technique, we can assist with memory rework tasks that lead to data recovery.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.