Laser processing with suppressed heat influence! It excels in precision, reliability, and operability.
The "MCS Series" is a high-precision water laser processing machine. It can process holes (0.76mmφ) in superalloy (8mm thick) in 70 seconds. With high machine accuracy (error +/-1.5km), the cutting width is a minimum of 30μm. Additionally, due to water jet cooling, there is virtually no thermal impact, and it enables perfectly parallel cutting edges and hole processing with a cylindrical beam. 【Features】 ■ High speed and accuracy ■ Cooling and removal ■ User-friendly *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
【Processable Materials】 ■ Metals - Superalloys, stainless steel, aluminum, copper, nickel, titanium, etc. ■ High Hardness Materials - Alumina sintered bodies, cubic boron nitride sintered bodies, polycrystalline diamond, single crystal diamond, cemented carbide ■ Ceramic Matrix Composites (CMCs) - Carbon, alumina, silicon carbide 【Lineup】 ■ MCS300 ■ MCS500 *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Main Industrial Applications】 ■ Energy: Industrial Gas Turbines ■ Aerospace: Jet Engines ■ Tools: Inserts ■ Automotive: Automotive Parts ■ Micro Machining: High-Precision Parts *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
News about this product（1）
Company information
〇 Shinova offers innovative laser cutting devices suitable for a wide range of micro-machining and dicing. 〇 Our mission is to provide cost competitiveness and technical advantages to our customers who manufacture cutting-edge devices through our technology. 〇 With our patented technology, the laser is guided straight through a water jet as thin as a human hair. 〇 This water jet enables cutting, grooving, and scribing of materials. 〇 The water jet prevents the divergence of the laser, allowing for high-precision cutting that cannot be achieved with conventional lasers or diamond blades. 〇 Additionally, the low-pressure water flow cleans while cooling the cutting surface, enabling processing without causing thermal effects, contamination, or deformation of advanced materials. 〇 Furthermore, improvements in productivity and cost reduction can also be expected.