SYNOVA JAPAN

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SYNOVA JAPAN Company Profile
Here is a new generation of high-precision processing technology, the "Water Jet Guided Laser Cutting System."
〇 Shinova offers innovative laser cutting devices suitable for a wide range of micro-machining and dicing. 〇 Our mission is to provide cost competitiveness and technical advantages to our customers who manufacture cutting-edge devices through our technology. 〇 With our patented technology, the laser is guided straight through a water jet as thin as a human hair. 〇 This water jet enables cutting, grooving, and scribing of materials. 〇 The water jet prevents the divergence of the laser, allowing for high-precision cutting that cannot be achieved with conventional lasers or diamond blades. 〇 Additionally, the low-pressure water flow cleans while cooling the cutting surface, enabling processing without causing thermal effects, contamination, or deformation of advanced materials. 〇 Furthermore, improvements in productivity and cost reduction can also be expected.

Business Activities
At Shinova Corporation, we currently offer six models of water jet guided lasers. - LDS - Laser Dicing System - LGS - Laser Grinding System - LSS - Laser Stencil System - LCS - Laser Cutting System - HLS - Hybrid Laser Saw (for wafer hybrid dicing) - LCP - Laser Doping System
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Detailed information
Company name | SYNOVA JAPAN |
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Contact address | postalcode 152-0031 Tokyo/ Meguro-ku/ Nakanone 2-10-4View on map TEL:03-3725-6778 FAX:03-3725-6779 |
Industry | Optical Instruments |
