Clean processing without spatter attachment is possible! The evaluation of LMJ technology can be done through sample processing.
We offer "LMJ (Laser Micro Jet) processing," suitable for diamond machining, regardless of whether it is natural, synthetic, single crystal, or polycrystalline. High aspect ratio groove processing is possible with a focus-free parallel beam. Evaluation of LMJ technology can be conducted through sample processing. Additionally, advice from experienced process engineers is available. Please feel free to consult us about any specific technical challenges in semiconductors, ceramics, hard tools, aerospace, or other areas. 【Features】 ■ Clean processing without sputter adhesion is possible due to the use of ultra-pure water. ■ High aspect ratio groove processing is achievable with a focus-free parallel beam. ■ Prototype processing for evaluation and contract processing during mass production startup are also available. *For more details, please refer to the related links or feel free to contact us.
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〇 Shinova offers innovative laser cutting devices suitable for a wide range of micro-machining and dicing. 〇 Our mission is to provide cost competitiveness and technical advantages to our customers who manufacture cutting-edge devices through our technology. 〇 With our patented technology, the laser is guided straight through a water jet as thin as a human hair. 〇 This water jet enables cutting, grooving, and scribing of materials. 〇 The water jet prevents the divergence of the laser, allowing for high-precision cutting that cannot be achieved with conventional lasers or diamond blades. 〇 Additionally, the low-pressure water flow cleans while cooling the cutting surface, enabling processing without causing thermal effects, contamination, or deformation of advanced materials. 〇 Furthermore, improvements in productivity and cost reduction can also be expected.
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