[Thesis] Water Laser Processing Machine MCS Device

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last updated：May 13, 2015

SYNOVA JAPAN

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New Developments in Laser Microjet Technology

The water jet-guided laser technology (trademarked as Laser Microjet: LMJ) is known as a patented method that enables the stable guidance of high-power lasers to materials using a fine layer water jet with a diameter of 100μm, realized through a disk-shaped liquid supply space. 【Contents】 ○ Introduction ○ LMJ Processing Principles and Features ○ MCS Processing Machine ○ Processing Examples ○ Conclusion For more details, please contact us or download the catalog.

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【Contents】 ○Introduction ○Principles and Features of LMJ Processing ○MCS Processing Machine ○Processing Examples ○Conclusion ●For more details, please contact us or download the catalog.

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[Thesis] Water Laser Processing Machine MCS Device

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We will exhibit at the Visualization Information and Fluid Power Technology Forum held on May 14.

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Are you aware of how the generally lesser-known flow phenomena in everyday life and fluid power technology are being utilized to address the development of medical technology and various challenges faced by society? It helps to enhance knowledge that aids in understanding and gaining insights into increasingly complex social issues. Additionally, this time we are holding an exhibition simultaneously, creating a forum where you can listen to lectures, see exhibits, and experience them. We warmly invite you and your family to come.

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SYNOVA JAPAN

Optical Instruments

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〇 Shinova offers innovative laser cutting devices suitable for a wide range of micro-machining and dicing. 〇 Our mission is to provide cost competitiveness and technical advantages to our customers who manufacture cutting-edge devices through our technology. 〇 With our patented technology, the laser is guided straight through a water jet as thin as a human hair. 〇 This water jet enables cutting, grooving, and scribing of materials. 〇 The water jet prevents the divergence of the laser, allowing for high-precision cutting that cannot be achieved with conventional lasers or diamond blades. 〇 Additionally, the low-pressure water flow cleans while cooling the cutting surface, enabling processing without causing thermal effects, contamination, or deformation of advanced materials. 〇 Furthermore, improvements in productivity and cost reduction can also be expected.

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