~Anodic bonding, thin film metal bonding, hermetic packaging, vacuum sealing~
★How can we achieve a balance between cost and reliability for the practical application and competitiveness of MEMS!? ★A thorough explanation of the know-how for wafer-level packaging, which will be a key technology!! 【Lecture Summary】 Wafer-level packaging has become a key technology for the practical application and competitiveness of MEMS. In this lecture, we will explain the entire scope of MEMS wafer-level packaging, from key points to know-how, using abundant real-world examples.
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basic information
【Venue】 Tokyo Chuo Ward Industrial Hall 4F, Meeting Room 1【Tokyo, Chuo Ward】 【Date and Time】 May 23, 2013 (Thursday) 12:30-16:15 【Speakers】 Part 1: Associate Professor Hidetoshi Tanaka, Graduate School of Engineering, Tohoku University Part 2: Associate Professor Jun Mizuno, Waseda University Nano-Science and Nano-Engineering Research Organization
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Early bird discount price: 49,350 yen (including tax and text costs) for up to 2 people from one company.
Price range
P2
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P2
Applications/Examples of results
Part 1: Wafer-Level Packaging Technology for MEMS [12:30-14:30] [Program] 1. What is Wafer-Level Packaging for MEMS? 2. Wafer-Level Hermetic Packaging via Anodic Bonding 2-1. Wiring Extraction Method Using Glass Wafers 2-2. Vacuum Sealing and Getter 2-3. LTCC Substrates Suitable for Anodic Bonding 3. Wafer-Level Packaging via Thin-Film Metal Bonding 3-1. Wafer-Level Packaging via Solid-State Metal Bonding 3-2. Wafer-Level Packaging via Liquid-Phase Intermetallic Bonding 4. Wafer-Level Packaging via Other Bonding Technologies 4-1. Wafer-Level Packaging via Frit Glass Bonding 4-2. Wafer-Level Packaging via Solder Bonding 5. Wafer-Level Packaging via Thin-Film Deposition 6. Summary and Key Points [Q&A and Business Card Exchange] Part 2: Low-Temperature Bonding and Material Technology for MEMS Devices to Improve Reliability (Tentative) [14:45-16:00]
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