Tabletop reflow furnace (heating furnace) compatible with heating up to 400℃.
This is a tabletop heating furnace capable of heating printed circuit boards and flat workpieces up to 250x330mm as standard. The heating temperature profile can be set for up to 8 zones. It can be used not only for reflow soldering but also for long-term operation at a constant temperature, making it suitable for applications such as drying circuit boards, thermal curing of underfill materials, and die bonding pastes.
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basic information
Features - Supports heating up to a maximum of 400℃ - Temperature profile settings for up to 8 zones - Continuous operation at a constant temperature for up to 10 hours - Equipped with process gas inlet and outlet ports such as nitrogen gas - Equipped with an observation window to monitor the heating state - Easy settings and operation via a touch panel - Standard equipped with thermocouple ports for work temperature control
Price information
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Price range
P5
Delivery Time
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Applications/Examples of results
Reflow soldering, resin curing, heating evaluation test
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Company information
Our company was founded in 1976 in Okaya City, Nagano Prefecture, and since then, we have expanded our export business of machine tools to the Chinese and Southeast Asian markets. Starting in 1997, we began importing, selling, and servicing equipment for the electronics industry. Currently, we are also working on the development of our own products, such as various reflow soldering machines and ultrasonic metal joining devices, to meet market needs.