The world's smallest class reflow oven (TRF-95) is finally on sale! ~ A compact reflow oven for easy and convenient use in labs or at home ~
Compared to conventional commercial products, we have achieved significant miniaturization, weight reduction, and low cost! Anyone can easily reflow cream solder on a wiring board anywhere and in a short time. The original product introduced by Taisei Co., Ltd., the tabletop reflow furnace, features: - A compact size that is less than half that of conventional products! - The ability to observe solder melting through glass! - Suppression of flux and solder splatter outside the furnace! We also accept custom sizes to fit your hot plate. Please feel free to contact us.
Inquire About This Product
basic information
【Features】 ■ Compact and lightweight reflow oven (Dimensions: W110mm × D127mm × H16mm, Weight: 346g) ■ Reflow device with hot plate (Dimensions: W194 × D292 × H110mm, Weight: 3.2kg) (Recommended hot plate: When combined with As One CHP-170DF) ■ Easy temperature setting with a digital temperature controller. ■ Optimized oven structure to achieve uniform temperature on the reflow plate where samples are placed. ■ Can reflow cream solder on printed circuit boards in about 30 seconds. ■ Progress of reflow can be monitored through the glass lid. The world's smallest class reflow oven (TRF-95) is finally on sale! The original tabletop reflow oven introduced by Taisei Co., Ltd. has achieved significant miniaturization, weight reduction, and low cost compared to conventional commercial products. Anyone, anywhere, in a short time, can easily reflow cream solder on printed circuit boards. When using, we recommend the combination of the As One Co., Ltd. hot plate CHP-170DF and our dedicated cover for the heater device. For more details, please refer to the catalog or feel free to contact us.
Price information
Please contact us.
Price range
P3
Delivery Time
※The delivery time may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
Reflow and soldering after electronic component mounting.
Detailed information
-
Desktop Solder Reflow Oven TRF-95 Dimensions: W110mm × D127mm × H16mm Weight: 346g Desktop Solder Reflow Oven TRF-125 Dimensions: W140mm × D157mm × H17mm
-
Desktop Solder Reflow Equipment TR-20S Reflow device with hot plate (Dimensions: W194×D292×H110mm, 3.2Kg) 《Configuration》 Manufacturer: As One, Hot Plate CHP-170DF, with our company's dedicated cover.
-
Desktop Solder Reflow Equipment TR-20S
catalog（3）
Download All Catalogs
Company information
Taisei Corporation provides innovative solutions to address the frustrations and inconveniences faced by researchers and developers through its product sales, engineering, and processing businesses. In the engineering sector, we cater to a wide range of needs from small-batch, diverse prototypes to mass production, offering products such as one of the world's smallest compact vacuum reflow ovens, cordless ionizer guns, 3BM retainer rings, bobbin racks for optical fibers, custom probes and needles, and joystick manipulators. We deliver design and manufacturing tailored to our customers' needs quickly and flexibly, creating products that solve the challenges faced by researchers and developers.
![[Sintering Material Compatible] Vacuum and Reduction Sintering Furnace <Maximum 615×615mm>](https://image.mono.ipros.com/public/product/image/43427/IPROS15682486374808681803.png?w=280&h=280)