Introducing the ultra-compact vacuum high-power reflow furnace (TR-125VH3) in the world's smallest class of reflow furnace series!
The ultra-compact vacuum high-power reflow furnace (TR-125VH3) from Taisei Corporation has a heating speed that is three times faster than our conventional models! (21℃/min) By combining it with a cooling reflow plate, cooling performance is improved! It prevents oxidation in a vacuum or nitrogen atmosphere, allowing for high-quality soldering, and due to low-temperature heating, it prevents deterioration and distortion of components. It eliminates the need for flux and cleaning agents, leading to cost reduction and lower environmental impact. This is an essential machine for researchers and developers pursuing cutting-edge technology, enhancing development quality and speeding up development processes.
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basic information
■Reflow Oven Dimensions: W110×D127×H16mm Weight: less than 350g Internal Space: W116×D116×H16mm Lid Opening/Closing: Arm fixed type ■Hot Plate Dimensions: W200×D260×H118mm Weight: less than 5.1kg Power Supply: AC100V 50/60Hz Heater Capacity: 1300W Maximum Temperature: 430℃ (Rapid heating in about 30 minutes) Maximum Usage Temperature in Reflow Oven: 260℃ ■Temperature Controller Dimensions: W85×D170×H103mm Weight: 0.9kg --------------------------------------------------- ■Size: Less than 1/20 of conventional vacuum reflow ovens. ■Atmosphere: Capable of vacuum and nitrogen purging. ■Maximum Operating Temperature: 300℃ (Constantly at 260℃) ■Heating Speed: 3 times faster (21℃/min) to reach (compared to our company) ■Temperature Control: Temperature profile settings are possible. (Can be output to PC when combined with temperature controller) *Temperature controller sold separately.
Price information
It varies depending on the composition, so please contact us.
Price range
P4
Delivery Time
※The delivery time may vary depending on the quantity and options, so please feel free to contact us.
Applications/Examples of results
Reflow soldering of electronic components in a vacuum and nitrogen atmosphere.
Detailed information
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Reflow Oven TR Series Specification Comparison Table (Excerpt) For more details, please visit our company website.
Line up（3）
| Model number | overview |
|---|---|
| TR-125V2 | The ultra-compact vacuum reflow oven TR-125V2 is designed to be ultra-lightweight and compact, making it easy to install even in labs, and is among the smallest in the world! Recommended hot plate: Combine with As One ND-1A for high-precision temperature control through PID control. You can set temperature profiles that were not possible with previous models using the hot plate's programming function, and temperature profiles can be output to a PC. (Software included) *USB cable sold separately |
| TRF-125V | The ultra-compact vacuum reflow oven TRF-125V allows for reflow by preventing oxidation of electronic components, wiring boards, electrodes, and solder using a vacuum environment or nitrogen gas, all at a reasonable price. |
| TR-20 | The compact and lightweight tabletop solder reflow oven TR-20 is a lightweight and compact furnace (dimensions: W110mm×D127mm×H16mm, weight 346g) combined with a recommended temperature controller hot plate, making it easy for anyone to perform reflow in a short time. It is ideal for beginners and for use in labs or at home. |
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Company information
Taisei Corporation provides innovative solutions to address the frustrations and inconveniences faced by researchers and developers through its product sales, engineering, and processing businesses. In the engineering sector, we cater to a wide range of needs from small-batch, diverse prototypes to mass production, offering products such as one of the world's smallest compact vacuum reflow ovens, cordless ionizer guns, 3BM retainer rings, bobbin racks for optical fibers, custom probes and needles, and joystick manipulators. We deliver design and manufacturing tailored to our customers' needs quickly and flexibly, creating products that solve the challenges faced by researchers and developers.
