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  6. Carbon Fiber High Thermal Conductivity Sheet IceCarbonPro2

Carbon Fiber High Thermal Conductivity Sheet IceCarbonPro2

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WW-LTR401Z

last updated:Dec 13, 2024

ワイドワーク
ワイドワーク
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Carbon fiber high thermal conductivity sheet that eliminates thermal resistance to the utmost limit.

This is a thermal conductive sheet made by highly filling carbon fibers with high thermal conductivity, eliminating gaps between the fibers and thoroughly removing thermal resistance. Therefore, it can quickly transfer heat from high-energy density heating elements to heat dissipation components, facilitating cooling. It is used by placing it between heating and heat dissipation components to enable rapid and efficient heat transfer and dissipation. 【Features】 ● By highly filling carbon fibers, the thermal conductivity in the thickness direction is significantly improved. ● It quickly transfers heat from the heating element to the heat sink, protecting the heating element from heat. For example, when used with a computer CPU, it quickly transfers heat from the CPU to the CPU cooler, safeguarding the CPU from heat. By rapidly transferring heat, it can also reduce the stress on the CPU. ● Compared to grease, it has less aging degradation and can maintain cooling performance for a long time. In the case of grease, reapplication is necessary after prolonged use, but with this product, there is no need for reapplication, and handling is easy.

    fiberIndustrial PCsEmbedded Board Computers
LTR-401C(220・220).jpg

Carbon Fiber High Thermal Conductivity Sheet IceCarbonPro2

LTR-401C(220・220).jpg
LTR-401C(220・220).jpg
  • Related Link - https://www.widework.co.jp/page12#ttl-WWLTR401Z

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basic information

Model number: WW-LTR401Z - Material: Carbon fiber - Size: 40mm × 40mm × thickness 0.5mm - Thermal conductivity: 40W/m·K - Color: Dark Gray - Hardness: 50-60 Shore00 - Operating temperature range: -40℃ to 150℃ - Specific gravity: 2.4 - Volume resistivity: 1×10^1 Ω·cm - Dielectric breakdown voltage: <0.1 AckV/mm - Non-stick, conductive, made in Japan

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Applications/Examples of results

It is used by placing it between the heat-generating component (such as a CPU) and the heat sink. This includes heat dissipation for semiconductor devices such as CPUs, GPUs, high energy density LEDs, power transistors, and ICs. It is applicable for servers, industrial equipment, etc.

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Carbon Fiber High Thermal Conductivity Sheet Ice Carbon Pro2 Product Catalog

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Industrial Electrical Equipment

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Nidec Corporation Authorized Dealer Taiwan CHIA CHERNE General Agent Taiwan SUNON Sales Agent Taiwan PRO-ARIES INDUSTRIES General Agent Tranyoung Technology Sales Agent Taiwan Thermal Transtech International General Agent

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