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  6. Trends in the Design and Development of Insulating Thermal Conductive Resins and Technologies for Enhancing Thermal Conductivity

Trends in the Design and Development of Insulating Thermal Conductive Resins and Technologies for Enhancing Thermal Conductivity

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last updated:Feb 13, 2020

AndTech
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Polymer Structure and Thermal Conductivity in PPS-based Compounds and Molecular Simulations

Insulating Plastics with High Thermal Conductance: Designs, PPS, Studies in silico, etc. ★What are the key points for achieving a balance between insulation and thermal conductivity in plastics!? ★How far can we go in achieving a balance of thermal conductivity, insulation, and impact resistance through the compounding of PPS!? ★What are the key points in designing high thermal conductivity polymers based on the relationship between molecular structure and thermal vibrations!? 【Venue】 Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 1【Tokyo, Chuo Ward】 4 minutes from Exit B3 of Higashi-Nihonbashi Station on the Toei Asakusa Line towards Asakusabashi and Oshiage 5 minutes from Exit B4 via the underground passage from Bakuroyokoyama Station on the Toei Shinjuku Line Date and Time June 26, 2013 (Wednesday) 13:00-17:15

    Technical Seminar
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Trends in the Design and Development of Insulating Thermal Conductive Resins and Technologies for Enhancing Thermal Conductivity

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**Part 1: Summary of the Lecture** PPS resin is expanding its market as a high-performance engineering plastic for automotive and electrical/electronic component applications. Like other resins, PPS is a low thermal conductivity material; however, due to the increasing demand for high functionality and high output in automotive and electrical/electronic components, there is a growing need for resin materials to possess thermal conductivity. In this presentation, we will introduce the development concept and features of the high thermal conductivity insulating materials we are developing. **Part 3: Summary of the Lecture** In recent years, with the miniaturization, high performance, and expanded usage of various electronic devices, the amount of heat generated within these devices has increased, making heat dissipation a significant issue. Polymers are widely used as insulating materials in electronic devices due to their excellent electrical insulation properties. However, their significantly low thermal conductivity becomes a bottleneck for heat dissipation, leading to a demand for high thermal conductivity in insulating polymers. To achieve high thermal conductivity in polymers, it is important to understand the complex relationship between polymer structure and the thermal vibrations of the atoms and molecules responsible for thermal conductivity. This lecture will clarify the relationship between polymer structure and thermal conductivity through molecular simulations.

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[Early Bird Discount Price] 52,500 yen (tax included, including text costs) for up to 2 people from one company.

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Part 1: Development of PPS-based Compound Insulating and High Thermal Conductive Resin [13:00-14:15] Instructor: DIC Corporation Part 2: Thermal Conductivity of Insulating Polymers through Molecular Simulation [14:30-15:45] Instructor: Mitsubishi Electric Corporation Part 3: "Design of Insulating High Thermal Conductive Sealing Materials and Technologies for High Heat Resistance and High Heat Dissipation" [16:00-17:15] Instructor: Sumitomo Osaka Cement Co., Ltd.

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Our company has developed its business from "seminar planning" to various forms such as "lecturer dispatch," "publishing planning," "technical consultant dispatch," "trend research," "business matching," and "business development consulting," in order to support clients in a wide range of fields including chemistry, electronics, automotive, energy, medical devices, food, and building materials. By doing so, we have advanced our company and opened up new markets. AndTech promises to continue listening to our clients' voices, entering the business areas and markets they desire, and to remain a company that is loved by our clients, as we share their challenges, think together, and forge new paths.

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