Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.
S30641
The heat dissipation and heat resistance of components required due to the increase in large currents!
- Sealing, Bonding, Mounting Technology, Reliability Evaluation - High-Power Devices: the Advanced Materials and the Mounting Technology ★ The heat dissipation and heat resistance required for components due to increased current! ★ The demand for inverters is rising with the energy-saving of devices and the spread of EVs and HEVs. What are the future technological trends of power devices, which are the core technology!? 【Venue】 Kawasaki City International Exchange Center, Conference Room 1【Kanagawa, Kawasaki】 12 minutes on foot from Motosumiyoshi Station on the Tokyu Toyoko Line Date and Time June 27, 2013 (Thursday) 10:15-16:30
Inquire About This Product
basic information
**Part 1: Summary of the Lecture** Power devices generate heat during operation, so the materials used in these devices need to have heat resistance and heat dissipation properties. This seminar will clearly and in detail explain the development history of high heat-resistant and high heat-dissipating materials for consumer power devices, current issues, and future countermeasures. **Part 2: Summary of the Lecture** SiC devices can operate at temperatures above 250°C, but it is currently difficult to address this with existing packaging technologies. Here, we will particularly introduce new conductive connection technologies aimed at high-temperature resistant devices. **Part 3: Summary of the Lecture** What control devices are power modules used in, and what functions do they have? How do they differ from general semiconductors (such as DRAM and custom LSI)? What are the important factors for ensuring reliability during the manufacturing process? What types of manufacturing and quality assurance equipment are used? As miniaturization progresses, how is the packaging technology changing? **Part 4: Overview of the Lecture** This lecture will provide a detailed explanation of the requirements for power devices and the power module structures and reliability evaluations that meet those requirements.
Price information
[Early Bird Discount Price] 52,500 yen (tax included, including text costs) for up to 2 people from one company.
Price range
P2
Delivery Time
P2
Applications/Examples of results
Part 1: Improvement of Heat Resistance and Heat Dissipation in Encapsulation Materials for Power Devices [10:15-11:30] Instructor: Aipack Co., Ltd. Part 2: High Heat Resistance Chip Interconnection Technology in Power Devices [12:15-13:30] Instructor: Waseda University Part 3: Practical Implementation Technology for Automotive Power Modules [13:45-15:00] Instructor: Lintec Engineering Office Part 4: Reliability Evaluation of Power Modules [15:15-16:30] Instructor: Chiba Institute of Technology
Company information
Our company has developed its business from "seminar planning" to various forms such as "lecturer dispatch," "publishing planning," "technical consultant dispatch," "trend research," "business matching," and "business development consulting," in order to support clients in a wide range of fields including chemistry, electronics, automotive, energy, medical devices, food, and building materials. By doing so, we have advanced our company and opened up new markets. AndTech promises to continue listening to our clients' voices, entering the business areas and markets they desire, and to remain a company that is loved by our clients, as we share their challenges, think together, and forge new paths.
