It can be used for transporting trays weighing 4 kgf or less within the vacuum chamber.
The vacuum-compatible 3-axis cylindrical coordinate clean robot SVCR3330S series has a payload capacity equivalent to 10 kgf at the third joint of the arm (including chuck and work), and can accommodate a maximum allowable bending moment of 25 N·m. Due to its high rigidity and high load capacity, it is capable of transporting trays with wafers and small glass substrates. The adoption of a shuttle-type twin chuck allows for a reduction in work exchange time. The vacuum sealing method uses a magnetic fluid field-through (2-axis type) and a welded bellows (stroke 60 mm), achieving a vacuum level of 1.33×10^-6 Pa. For more details, please contact us or refer to the catalog.
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【Features】 ○ Arm variation: 330mm ○ Z-axis variation: 60mm ○ Load capacity: 10kgf or less at the third joint ○ Magnetic fluid seal equipped at the arm joint ○ Vacuum seal: uses magnetic fluid seal and bellows ○ Cleanroom compatible: equipped with a 5μm mesh filter for arm exhaust ○ Operating monitor equipped ○ Control method: RS232C and parallel photo I/O ○ All axes use 2-phase stepping motors ○ High-speed and high-precision wafer transport through S-curve acceleration and deceleration control ○ Servo motor specifications are also available as an option ○ Chuck materials can be various, including CFRP, aluminum, ceramics, etc. ○ Wafer holding: drop-in, self-weight grip chuck ○ Can accommodate optimal chucks according to the transported object and equipment layout ● For more details, please contact us or refer to the catalog.
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