Ideal for multilayer structure implementation combined with semiconductor substrates, including MEMS.
"Spacer glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during notching or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (Wafer Level Packaging) along with semiconductor substrates, or when dicing at the device level. Furthermore, post-processing can eliminate chipping. [Features] - Suppression of flaring around holes - Reduction of chipping - Capable of handling chipping down to ≦10μm - Removal of microcracks generated during glass processing, controlling particles - Reduces operational failures caused by particles after bonding with MEMS devices *For more details, please download the catalog or contact us.
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We will propose the most suitable solutions that match our customers' requirements, considering quality, cost, and mass production, through our advanced composite processing technology (Cross Edge Micro Machining), which combines five cutting-edge techniques: cutting, grinding, polishing, metalizing, and joining.