Notice of Participation in Ceatec Japan 2018

For bio-medical glass products. High transparency allows for clear observation. Exhibition participation.

Our company is engaged in the development and manufacturing of products using composite processing technology that combines techniques such as cutting, grinding, polishing, metallizing, and bonding. Among these, the "Undercut Bottom Transparent Processing" can finish the undercut bottom surfaces of glass materials such as Pyrex, Tempax, and quartz to a mirror-like state. The improvement in transparency allows for clearer observation from the outside, making it useful in fields such as bio and medical applications. 【Features】 ■ Metallization on side walls prevents light interference and absorption ■ Hole diameter, hole shape, and undercut depth can be freely set ■ Compatible with wafers up to φ200mm ■ Glass thickness can be set from 0.1 to 0.15mm to match the focal length of liquid immersion lenses *We are currently offering materials introducing our microfabrication technology! You can view more details from the 【PDF Download】. ★ We will be exhibiting at "CEATEC JAPAN 2018" ★

• Other processing machines
• Processing Contract

The window section can be made thinner and more transparent. It is suitable for applications such as the transmission of laser light or LED light and observation with immersion microscopy through the window section.

High-precision cavities are formed inside the glass substrate. The window section can be made thin and transparent, allowing laser light and LED light to pass through without distortion, making it suitable for applications such as observation with an immersion microscope through the window. By shielding the glass sidewalls, unnecessary light can also be blocked. By implementing three-dimensional wiring from the bottom to the top of the glass, reliability can be improved while maintaining transparency. This also allows for a review of the assembly process, leading to space-saving solutions. 【Features】 - Transparent processing of the cavity bottom is possible - Metallization on the sidewalls is possible - Three-dimensional wiring shapes are possible *For more details, please contact us or download the catalog.

• Processing Contract
• Surface treatment contract service
• Glass

Combining multiple processes to develop innovative products! We propose solutions that match your needs.

"Cross-edge microfabrication" refers to a processing method that combines two or more different types of processing within the manufacturing of a single product. The five core processing techniques are "cutting, grinding, polishing, metallizing, and joining." At our company, we propose solutions that match our customers' needs by considering "quality, cost, and mass production" through composite processing technology that crosses these five advanced techniques. [Features] ■ Maintains stable quality ■ Achieves processing with short lead times ■ Provides cost-effective services ■ Solves customer challenges by developing innovative products through the combination of multiple processes *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Processing Contract
• Glass

Three-dimensional wafer-level packaging (WLP) is suitable for miniaturizing semiconductors. Through-silicon vias enable improvements in high-frequency characteristics.

This product features numerous electrically conductive metal via-holes formed within borosilicate glass substrates such as Pyrex and Tempax. It can accommodate substrates up to a maximum diameter of 8 inches. It has good flatness and airtightness, making it suitable for anodic bonding for sealing silicon-based devices. 【Features】 ○ Capable of anodic bonding with silicon wafers Solves outgassing issues by enabling anodic bonding without the use of adhesives. ○ Excellent high-frequency characteristics - Ensures low stray inductance and low electrical resistance of vias. - Achieves high insulation compared to silicon by using glass as the base material. ○ Designed to function as a heat sink - Allows the vias to serve as thermal vias by incorporating silicon. ○ Transmits visible light - Enables confirmation of bonding points and transmission of optical signals. ○ Compatible with wafers up to Φ200mm. *For more details, please download the catalog or contact us.

• Glass

Ideal for multilayer structure implementation combined with semiconductor substrates, including MEMS.

"Spacer glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during notching or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (Wafer Level Packaging) along with semiconductor substrates, or when dicing at the device level. Furthermore, post-processing can eliminate chipping. [Features] - Suppression of flaring around holes - Reduction of chipping - Capable of handling chipping down to ≦10μm - Removal of microcracks generated during glass processing, controlling particles - Reduces operational failures caused by particles after bonding with MEMS devices *For more details, please download the catalog or contact us.

• Glass

It can achieve anodic bonding without using adhesive, solving the outgassing problem. Compatible with wafer-level packaging (WLP).

"Small diameter hole glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during groove or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (wafer-level packaging) along with semiconductor substrates or when dicing at the device level. Furthermore, it is possible to eliminate chipping through post-processing. 【Features】 ○ Small diameter hole processing ・Achieves a minimum diameter of 0.1 mm ○ Compatible with wafers up to 300 mm in diameter (For some processing, compatibility is up to 200 mm) ○ Suppresses burrs around the hole area ○ Reduces chipping ・Can accommodate chipping levels of ≤10 μm *For more details, please download the catalog or contact us.

• Glass

Glass alone without the use of organic substances such as adhesives. Sharp edge shapes can be achieved.

Glass microchannels (minimum 50μm) can be produced using borosilicate glass and quartz glass. The bottom surface is transparent, and sharp edge shapes can be achieved. Furthermore, since it is made solely of glass without the use of any organic materials such as adhesives, it excels in transparency, chemical resistance, and heat resistance. 【Main Features】 - Can be produced using borosilicate glass and quartz glass - The bottom surface is transparent, and sharp edge shapes can be achieved - Made solely of glass without the use of any organic materials such as adhesives - Excellent transparency, chemical resistance, and heat resistance For more details, please download the catalog or contact us.

• Other processing machines
• Processing Contract

Achieved square holes without R, which was "impossible" with conventional processing technology. Also capable of small diameters and narrow pitches.

Multiple through holes of 0.2mm square were processed into 0.5t Pyrex glass, creating a mesh-like structure. This processing technology was developed for mass production and can accommodate various quantities. 【Features】 ○ Numerous through holes processed at 0.1mm × 0.1mm ・ (Example) 150,000 holes on a 3-inch wafer ○ Selection of through hole shapes possible with a high aspect ratio (1:8 to 10) ・ Supports straight and tapered shapes ○ Achieves chip-on-glass ・ Improved contact performance during anodic bonding with Si *For more details, please download the catalog or contact us.

• Glass

Glass processing with excellent transparency, chemical resistance, and heat resistance.

Our company offers glass processing that excels in transparency, chemical resistance, and heat resistance. The glass we recommend includes high-transparency quartz glass, Tempax glass, and others. 【Features】 ◎ Ultra-thin polishing possible from 0.1 to 0.15 mm → Enables observation of previously unobservable cells, proteins, DNA, etc. ◎ Enables analyses and liquid delivery to microchannels that were previously impossible 【PDMS (silicone resin)】 ◎ Anodic bonding (adhesive-free) with Si (silicon) is possible 【Tempax glass】 → No concerns about adverse effects on cells, etc., caused by adhesives ◎ Capable of producing microchannel products with groove widths of 30 to 50 μm, high aspect ratio channel products (width 100 μm, depth 800 μm), and channel products with vias (which allow for electrical control through electrophoresis by embedding vias) 【Channel products】 　　＼Please make use of the wonderful properties of glass in your bioanalysis and research／ *For more details, please contact us or download the catalog (PDF).

• Processing Contract
• Surface treatment contract service
• Glass

Resource Comprehensive System, which provides information, analysis, and consulting services related to solar power generation, will hold a public seminar titled "Reading Changes in the Solar Power Generation Market and Moving Towards the Next Growth - Summary of 2025 and Outlook for 2026" on Thursday, January 22, 2026. 【Seminar Date and Time】 January 22, 2026 (Thursday) 15:00 - 16:30 【Participation Fee】 The participation fee for the online seminar is free. You can view and participate via Zoom. 【Registration URL】 Please register in advance using the link below. (Participation is free) Registration Zoom address: https://us06web.zoom.us/webinar/register/WN_7phpAn6NRbSy8i5fZmBeiQ For more details about the seminar, please check our website at https://www.rts-pv.com/news/202512_20068/.

Does your organization face these challenges? ✅ Lack of proactive proposals: Relying on existing customers and failing to develop new ones ✅ Variability in the quality of hearings: Unable to extract essential needs and missing out on opportunities ✅ Information becoming a black box: Sales status is only in the minds of sales representatives and not part of the organization's knowledge Many manufacturing companies face the "dependency on existing customers." Why is it difficult to grow sales? We will identify the causes and provide specific methods to create a "system that anyone can sell." 【Recommended for】 - Those who want to break free from relying on existing customers and actively increase sales - Those who want to strengthen the proposal capabilities of the entire sales organization through standardized hearings - Those who want to eliminate dependency on individuals and accurately visualize the progress of projects ＞For more details, please see below 【Details of this news and application】.

【Latest Webinar Information Released】 "Reading the Cosmic Weathering of Ryugu Particles' Surfaces with Electron Microscopy" 【Speaker】 Associate Professor Masaaki Miyahara Graduate School of Advanced Science and Engineering, Hiroshima University ▼For more details▼ https://meiwanet.co.jp/tennant20_webiner2026/ ============ What You Will Learn in This Webinar ============ - Latest Insights on Ryugu Particles: Understanding the reality of cosmic weathering through traces of surface modification. - Practical High-Resolution SEM Observation: Methods to suppress charge-up and clearly observe the original structure. - Pre-treatment Techniques Supporting Analysis: The role of "ultra-thin conductive coatings" that do not compromise fine structures. ============ ▼For more details▼ https://meiwanet.co.jp/tennant20_webiner2026/ #Ryugu

In recent years, with the advancement of digitalization, companies have accumulated vast amounts of data. However, many companies face challenges such as "we have data, but we don't know how to handle it" and "data is isolated by department, lacking reliability (data silos)." No matter how vast the data is, if it cannot be valued, it is "a treasure wasted." In this webinar, we will explain the overall picture of data utilization step by step, from practical tips to streamline daily Excel tasks to advanced analysis using BI tools. We will organize the roles and specific applications of ETL for automating data processing, DWH (data warehouse) for centralized management, and BI tools for accelerating decision-making, and share the "mindset" needed to gain new insights centered around data. - Feeling limited by manual data aggregation in Excel - Data is scattered by department, making it difficult to see company-wide figures quickly - Want to know the "first step in data utilization" that can be started at the operational level If you have any of these concerns, please join us.

We are pleased to announce that we will be exhibiting at the 39th Annual Meeting of the Japan Society of Synchrotron Radiation Research and the Joint Symposium on Synchrotron Science, organized by the organizing committee. We invite you to visit us and take this opportunity to see our products. At our exhibition space, we will be introducing X-Spectrum and XCAM. We look forward to your visit.