Notice of Participation in Ceatec Japan 2018

For bio-medical glass products. High transparency allows for clear observation. Exhibition participation.

Our company is engaged in the development and manufacturing of products using composite processing technology that combines techniques such as cutting, grinding, polishing, metallizing, and bonding. Among these, the "Undercut Bottom Transparent Processing" can finish the undercut bottom surfaces of glass materials such as Pyrex, Tempax, and quartz to a mirror-like state. The improvement in transparency allows for clearer observation from the outside, making it useful in fields such as bio and medical applications. 【Features】 ■ Metallization on side walls prevents light interference and absorption ■ Hole diameter, hole shape, and undercut depth can be freely set ■ Compatible with wafers up to φ200mm ■ Glass thickness can be set from 0.1 to 0.15mm to match the focal length of liquid immersion lenses *We are currently offering materials introducing our microfabrication technology! You can view more details from the 【PDF Download】. ★ We will be exhibiting at "CEATEC JAPAN 2018" ★

• Other processing machines
• Processing Contract

The window section can be made thinner and more transparent. It is suitable for applications such as the transmission of laser light or LED light and observation with immersion microscopy through the window section.

High-precision cavities are formed inside the glass substrate. The window section can be made thin and transparent, allowing laser light and LED light to pass through without distortion, making it suitable for applications such as observation with an immersion microscope through the window. By shielding the glass sidewalls, unnecessary light can also be blocked. By implementing three-dimensional wiring from the bottom to the top of the glass, reliability can be improved while maintaining transparency. This also allows for a review of the assembly process, leading to space-saving solutions. 【Features】 - Transparent processing of the cavity bottom is possible - Metallization on the sidewalls is possible - Three-dimensional wiring shapes are possible *For more details, please contact us or download the catalog.

• Processing Contract
• Surface treatment contract service
• Glass

Combining multiple processes to develop innovative products! We propose solutions that match your needs.

"Cross-edge microfabrication" refers to a processing method that combines two or more different types of processing within the manufacturing of a single product. The five core processing techniques are "cutting, grinding, polishing, metallizing, and joining." At our company, we propose solutions that match our customers' needs by considering "quality, cost, and mass production" through composite processing technology that crosses these five advanced techniques. [Features] ■ Maintains stable quality ■ Achieves processing with short lead times ■ Provides cost-effective services ■ Solves customer challenges by developing innovative products through the combination of multiple processes *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Processing Contract
• Glass

Three-dimensional wafer-level packaging (WLP) is suitable for miniaturizing semiconductors. Through-silicon vias enable improvements in high-frequency characteristics.

This product features numerous electrically conductive metal via-holes formed within borosilicate glass substrates such as Pyrex and Tempax. It can accommodate substrates up to a maximum diameter of 8 inches. It has good flatness and airtightness, making it suitable for anodic bonding for sealing silicon-based devices. 【Features】 ○ Capable of anodic bonding with silicon wafers Solves outgassing issues by enabling anodic bonding without the use of adhesives. ○ Excellent high-frequency characteristics - Ensures low stray inductance and low electrical resistance of vias. - Achieves high insulation compared to silicon by using glass as the base material. ○ Designed to function as a heat sink - Allows the vias to serve as thermal vias by incorporating silicon. ○ Transmits visible light - Enables confirmation of bonding points and transmission of optical signals. ○ Compatible with wafers up to Φ200mm. *For more details, please download the catalog or contact us.

• Glass

Ideal for multilayer structure implementation combined with semiconductor substrates, including MEMS.

"Spacer glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during notching or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (Wafer Level Packaging) along with semiconductor substrates, or when dicing at the device level. Furthermore, post-processing can eliminate chipping. [Features] - Suppression of flaring around holes - Reduction of chipping - Capable of handling chipping down to ≦10μm - Removal of microcracks generated during glass processing, controlling particles - Reduces operational failures caused by particles after bonding with MEMS devices *For more details, please download the catalog or contact us.

• Glass

It can achieve anodic bonding without using adhesive, solving the outgassing problem. Compatible with wafer-level packaging (WLP).

"Small diameter hole glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during groove or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (wafer-level packaging) along with semiconductor substrates or when dicing at the device level. Furthermore, it is possible to eliminate chipping through post-processing. 【Features】 ○ Small diameter hole processing ・Achieves a minimum diameter of 0.1 mm ○ Compatible with wafers up to 300 mm in diameter (For some processing, compatibility is up to 200 mm) ○ Suppresses burrs around the hole area ○ Reduces chipping ・Can accommodate chipping levels of ≤10 μm *For more details, please download the catalog or contact us.

• Glass

Glass alone without the use of organic substances such as adhesives. Sharp edge shapes can be achieved.

Glass microchannels (minimum 50μm) can be produced using borosilicate glass and quartz glass. The bottom surface is transparent, and sharp edge shapes can be achieved. Furthermore, since it is made solely of glass without the use of any organic materials such as adhesives, it excels in transparency, chemical resistance, and heat resistance. 【Main Features】 - Can be produced using borosilicate glass and quartz glass - The bottom surface is transparent, and sharp edge shapes can be achieved - Made solely of glass without the use of any organic materials such as adhesives - Excellent transparency, chemical resistance, and heat resistance For more details, please download the catalog or contact us.

• Other processing machines
• Processing Contract

Achieved square holes without R, which was "impossible" with conventional processing technology. Also capable of small diameters and narrow pitches.

Multiple through holes of 0.2mm square were processed into 0.5t Pyrex glass, creating a mesh-like structure. This processing technology was developed for mass production and can accommodate various quantities. 【Features】 ○ Numerous through holes processed at 0.1mm × 0.1mm ・ (Example) 150,000 holes on a 3-inch wafer ○ Selection of through hole shapes possible with a high aspect ratio (1:8 to 10) ・ Supports straight and tapered shapes ○ Achieves chip-on-glass ・ Improved contact performance during anodic bonding with Si *For more details, please download the catalog or contact us.

• Glass

Glass processing with excellent transparency, chemical resistance, and heat resistance.

Our company offers glass processing that excels in transparency, chemical resistance, and heat resistance. The glass we recommend includes high-transparency quartz glass, Tempax glass, and others. 【Features】 ◎ Ultra-thin polishing possible from 0.1 to 0.15 mm → Enables observation of previously unobservable cells, proteins, DNA, etc. ◎ Enables analyses and liquid delivery to microchannels that were previously impossible 【PDMS (silicone resin)】 ◎ Anodic bonding (adhesive-free) with Si (silicon) is possible 【Tempax glass】 → No concerns about adverse effects on cells, etc., caused by adhesives ◎ Capable of producing microchannel products with groove widths of 30 to 50 μm, high aspect ratio channel products (width 100 μm, depth 800 μm), and channel products with vias (which allow for electrical control through electrophoresis by embedding vias) 【Channel products】 　　＼Please make use of the wonderful properties of glass in your bioanalysis and research／ *For more details, please contact us or download the catalog (PDF).

• Processing Contract
• Surface treatment contract service
• Glass

[Speaker] Kazuharu Yamamoto Partner Expert, Roland Berger Co., Ltd. [Key Lecture Content] In the automotive industry, the topic of EVs is ever-present. The advancement and promotion of EVs is a significant goal for achieving carbon neutrality (CN). On the other hand, the realization of CN and the progress of EVs are inseparable topics related to the realization of a circular economy (CE). In this lecture, I will present an overview of CE and CN, discuss the mechanisms of CE progressing in Europe, and the reverse supply chain, while also addressing the expansion of EVs and charging infrastructure from a consumer perspective. [Lecture Items] 1. Overview of CE and CN in the automotive industry and EVs 2. Mechanisms for achieving CE in Europe 3. Expansion of EVs and charging infrastructure (Characteristics of Japan within the global context) 4. Q&A / Business card exchange

[Speaker] Mitsune Shirasawa, Partner Attorney at TMI General Legal Practice [Key Lecture Content] The regulations that must be complied with when implementing payment businesses are defined by various laws, and it is common for the applicable laws to change due to subtle differences in the schemes adopted. Therefore, when building a business related to payments, it is essential to have not only an understanding of individual laws but also a cross-sectional understanding of how these laws interact with each other. Additionally, recent developments such as the categorization of money transfer businesses, the introduction of regulations regarding stablecoins, the clarification of payment collection services, and the emergence of new schemes like BNPL (Buy Now Pay Later) and BPSP (Business Payment Service Provider) have led to significant advancements and complexities in payment-related businesses. Thus, this seminar will provide a comprehensive explanation of the current regulations surrounding payment businesses and their practical responses. [Lecture Topics] 1. The environment surrounding payment legislation 2. Keywords related to payment and regulatory compliance 3. The overall picture of laws and regulations surrounding payments 4. Points to consider when building a business / When to consider potential conflicts with financial regulations 5. How to obtain permits and licenses related to payments 6. Q&A / Business card exchange

[Speaker] Yusuke Saiki Executive Officer, Consulting Division Head of Strategy & Innovation Unit Ignition Point Inc. [Key Lecture Content] As marketing becomes increasingly complex, the disconnect in "information, experience, and perspectives" between organizations, departments, and customer touchpoints has become a significant barrier to business growth. The key to overcoming this "era of division" lies in "co-creative marketing," which merges AI's analytical power with human creativity and empathy. In this lecture, we will introduce strategic approaches and specific actions based on practical examples of co-creative marketing that Ignition Point has supported. [Lecture Items] 1. The irreversible changes that AI brings to the business environment and the emergence of new challenges in marketing 2. Why is business growth being hindered in the digital age? 3. What is the key to overcoming division: "Co-creative Marketing Strategy"? 4. Based on Ignition Point's examples, the practice and strategic approach of "Co-creative Marketing Strategy" 5. Three steps to start implementing "Co-creative Marketing Strategy" from tomorrow 6. Q&A / Business card exchange

[Speaker] Yusuke Saiki Executive Officer, Consulting Division Head of Strategy & Innovation Unit, Ignition Point Inc. [Key Lecture Content] This presentation is aimed at solution sales professionals who feel the limitations of traditional, person-dependent sales methods. We will provide specific thinking methods, strategies, tools, and practical action plans to strategically leverage AI and shift from "passive problem-solving" to "active opportunity creation." Participants will gain insights and techniques to build a new sales style suitable for the AI era within their own sales organizations. [Lecture Items] 1. Why are changes occurring now in the sales environments of other companies? 2. The required transformation of sales styles 3. How to utilize generative AI to transform into proactive solution sales 4. Transitioning from problem-solving solution sales to problem-posing solution sales 5. Introduction and demonstration of practical tools and skills that can be used from today 6. Q&A / Business card exchange

[Key Lecture Content] 1. Overview of the grid-scale battery business and actual operations Kenji Eda, President of RAUL Co., Ltd. Director of the Energy Information Center 1. What is the grid-scale battery business? 2. Business revenue structure / various markets / subsidies, etc. 3. Flow from consideration of introduction to start of operation / points to note 4. Case studies of grid-scale batteries / introduction of actual cases 2. Business players in the grid-scale battery sector / specific company examples / Q&A for entry Hironobu Takeuchi, Manager of the Grid-Scale Battery Business Division at RAUL Co., Ltd. 1. Introduction to the classification of business players and their roles 2. Specific company examples for each player 3. Frequently asked questions and answers from entering companies 4. Q&A session / business card exchange