Notice of Participation in Ceatec Japan 2018

For bio-medical glass products. High transparency allows for clear observation. Exhibition participation.

Our company is engaged in the development and manufacturing of products using composite processing technology that combines techniques such as cutting, grinding, polishing, metallizing, and bonding. Among these, the "Undercut Bottom Transparent Processing" can finish the undercut bottom surfaces of glass materials such as Pyrex, Tempax, and quartz to a mirror-like state. The improvement in transparency allows for clearer observation from the outside, making it useful in fields such as bio and medical applications. 【Features】 ■ Metallization on side walls prevents light interference and absorption ■ Hole diameter, hole shape, and undercut depth can be freely set ■ Compatible with wafers up to φ200mm ■ Glass thickness can be set from 0.1 to 0.15mm to match the focal length of liquid immersion lenses *We are currently offering materials introducing our microfabrication technology! You can view more details from the 【PDF Download】. ★ We will be exhibiting at "CEATEC JAPAN 2018" ★

• Other processing machines
• Processing Contract

The window section can be made thinner and more transparent. It is suitable for applications such as the transmission of laser light or LED light and observation with immersion microscopy through the window section.

High-precision cavities are formed inside the glass substrate. The window section can be made thin and transparent, allowing laser light and LED light to pass through without distortion, making it suitable for applications such as observation with an immersion microscope through the window. By shielding the glass sidewalls, unnecessary light can also be blocked. By implementing three-dimensional wiring from the bottom to the top of the glass, reliability can be improved while maintaining transparency. This also allows for a review of the assembly process, leading to space-saving solutions. 【Features】 - Transparent processing of the cavity bottom is possible - Metallization on the sidewalls is possible - Three-dimensional wiring shapes are possible *For more details, please contact us or download the catalog.

• Processing Contract
• Surface treatment contract service
• Glass

Combining multiple processes to develop innovative products! We propose solutions that match your needs.

"Cross-edge microfabrication" refers to a processing method that combines two or more different types of processing within the manufacturing of a single product. The five core processing techniques are "cutting, grinding, polishing, metallizing, and joining." At our company, we propose solutions that match our customers' needs by considering "quality, cost, and mass production" through composite processing technology that crosses these five advanced techniques. [Features] ■ Maintains stable quality ■ Achieves processing with short lead times ■ Provides cost-effective services ■ Solves customer challenges by developing innovative products through the combination of multiple processes *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Processing Contract
• Glass

Three-dimensional wafer-level packaging (WLP) is suitable for miniaturizing semiconductors. Through-silicon vias enable improvements in high-frequency characteristics.

This product features numerous electrically conductive metal via-holes formed within borosilicate glass substrates such as Pyrex and Tempax. It can accommodate substrates up to a maximum diameter of 8 inches. It has good flatness and airtightness, making it suitable for anodic bonding for sealing silicon-based devices. 【Features】 ○ Capable of anodic bonding with silicon wafers Solves outgassing issues by enabling anodic bonding without the use of adhesives. ○ Excellent high-frequency characteristics - Ensures low stray inductance and low electrical resistance of vias. - Achieves high insulation compared to silicon by using glass as the base material. ○ Designed to function as a heat sink - Allows the vias to serve as thermal vias by incorporating silicon. ○ Transmits visible light - Enables confirmation of bonding points and transmission of optical signals. ○ Compatible with wafers up to Φ200mm. *For more details, please download the catalog or contact us.

• Glass

Ideal for multilayer structure implementation combined with semiconductor substrates, including MEMS.

"Spacer glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during notching or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (Wafer Level Packaging) along with semiconductor substrates, or when dicing at the device level. Furthermore, post-processing can eliminate chipping. [Features] - Suppression of flaring around holes - Reduction of chipping - Capable of handling chipping down to ≦10μm - Removal of microcracks generated during glass processing, controlling particles - Reduces operational failures caused by particles after bonding with MEMS devices *For more details, please download the catalog or contact us.

• Glass

It can achieve anodic bonding without using adhesive, solving the outgassing problem. Compatible with wafer-level packaging (WLP).

"Small diameter hole glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during groove or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (wafer-level packaging) along with semiconductor substrates or when dicing at the device level. Furthermore, it is possible to eliminate chipping through post-processing. 【Features】 ○ Small diameter hole processing ・Achieves a minimum diameter of 0.1 mm ○ Compatible with wafers up to 300 mm in diameter (For some processing, compatibility is up to 200 mm) ○ Suppresses burrs around the hole area ○ Reduces chipping ・Can accommodate chipping levels of ≤10 μm *For more details, please download the catalog or contact us.

• Glass

Glass alone without the use of organic substances such as adhesives. Sharp edge shapes can be achieved.

Glass microchannels (minimum 50μm) can be produced using borosilicate glass and quartz glass. The bottom surface is transparent, and sharp edge shapes can be achieved. Furthermore, since it is made solely of glass without the use of any organic materials such as adhesives, it excels in transparency, chemical resistance, and heat resistance. 【Main Features】 - Can be produced using borosilicate glass and quartz glass - The bottom surface is transparent, and sharp edge shapes can be achieved - Made solely of glass without the use of any organic materials such as adhesives - Excellent transparency, chemical resistance, and heat resistance For more details, please download the catalog or contact us.

• Other processing machines
• Processing Contract

Achieved square holes without R, which was "impossible" with conventional processing technology. Also capable of small diameters and narrow pitches.

Multiple through holes of 0.2mm square were processed into 0.5t Pyrex glass, creating a mesh-like structure. This processing technology was developed for mass production and can accommodate various quantities. 【Features】 ○ Numerous through holes processed at 0.1mm × 0.1mm ・ (Example) 150,000 holes on a 3-inch wafer ○ Selection of through hole shapes possible with a high aspect ratio (1:8 to 10) ・ Supports straight and tapered shapes ○ Achieves chip-on-glass ・ Improved contact performance during anodic bonding with Si *For more details, please download the catalog or contact us.

• Glass

Glass processing with excellent transparency, chemical resistance, and heat resistance.

Our company offers glass processing that excels in transparency, chemical resistance, and heat resistance. The glass we recommend includes high-transparency quartz glass, Tempax glass, and others. 【Features】 ◎ Ultra-thin polishing possible from 0.1 to 0.15 mm → Enables observation of previously unobservable cells, proteins, DNA, etc. ◎ Enables analyses and liquid delivery to microchannels that were previously impossible 【PDMS (silicone resin)】 ◎ Anodic bonding (adhesive-free) with Si (silicon) is possible 【Tempax glass】 → No concerns about adverse effects on cells, etc., caused by adhesives ◎ Capable of producing microchannel products with groove widths of 30 to 50 μm, high aspect ratio channel products (width 100 μm, depth 800 μm), and channel products with vias (which allow for electrical control through electrophoresis by embedding vias) 【Channel products】 　　＼Please make use of the wonderful properties of glass in your bioanalysis and research／ *For more details, please contact us or download the catalog (PDF).

• Processing Contract
• Surface treatment contract service
• Glass

This webinar will focus on Restek's newly announced GC column "RMX Series," explaining the analytical performance achieved through the latest passivation treatment technology and approaches to solving challenges in sample analysis that includes complex matrices. We will introduce the unique features of the new column format specific to the RMX Series and practical points for trace analysis, along with analysis examples using actual samples. We will also concretely present the applicability to routine analysis through actual case studies using the RMX Series. (External speaker: Mr. Eduardo from Weck Laboratories / Japanese dubbing) What you will learn in this webinar: - The features of the advanced passivation treatment technology adopted in the RMX Series GC columns and its analytical advantages. - The concepts for achieving high-sensitivity analysis at trace levels for a wide range of components, including acidic, basic, and neutral compounds. - Common challenges faced in complex sample analysis and solution approaches utilizing the RMX Series. - How selecting the optimal GC column format, including the RMX Series, can lead to improvements in analytical efficiency and lab operations.

[Speaker] Shogo Yakame, Expert Consultant, Urban Innovation Consulting Department, Nomura Research Institute, Ltd. [Key Lecture Content] In recent years, the space business has garnered significant attention both domestically and internationally. In particular, a new large fund, the "Space Strategy Fund," has been launched in Japan, and the space industry has been selected as one of the 17 key investment areas highlighted by the new administration under Prime Minister Takaichi. In light of these developments, the movement for new entrants into the space business is accelerating; however, voices expressing difficulties in launching and promoting new businesses due to the complexity of the industry structure, high entry barriers, and the current immaturity of the market are not uncommon. This lecture will specifically address the mindset when entering the space business from other industries, as well as the challenges that are likely to be encountered, explaining how to perceive and engage with the space business. [Lecture Items] 1. Overview of recent space business 2. Case studies of new entrants from other industries 3. Understanding the space business as a new venture 4. Challenges and points to consider in business planning and promotion 5. Summary 6. Q&A and exchange of opinions with participants / Business card exchange

[Speaker] Director Yuya Sato, Innovation Management Co., Ltd. [Purpose] Even in today's highly uncertain environment, the fact remains that research and development investments aimed at the future continue to be a source of competitive advantage for companies. By envisioning a desired future based on future hypotheses, we can translate that vision into actionable plans and adapt them flexibly to changes in the environment. To make effective research and development investments, it is necessary to execute this entire series of processes at a high level, and the roadmap is positioned as a management tool that supports this. In this seminar, based on approximately 15 years of consulting experience in formulating and executing technology strategies in the manufacturing industry, including the automotive sector, we will introduce specific methods and case studies on the development and effective use of technology roadmaps. The case studies will also explain the examination processes using generative AI, which has been increasingly utilized in recent years. Additionally, we will discuss the challenges many companies face in implementing and operating roadmaps, as well as solutions to those challenges.

Henkel Japan Co., Ltd.'s General Manufacturing & Maintenance Division will exhibit at the 25th SMART ENERGY WEEK [Spring] held at Tokyo Big Sight from March 17 (Tuesday) to March 19 (Thursday), 2026, within the "H2 & FC EXPO [Spring] - 25th [International] Hydrogen and Fuel Cell Exhibition." We will introduce innovative adhesive and sealant solutions compatible with hydrogen from Loctite and conduct application demonstrations. <Exhibited Products and Technologies> ■ [Hydrogen Compatible] Sealants for Hydrogen-Compatible Metal Piping: LOCTITE 567, LOCTITE 577, LOCTITE 638 ■ [Hydrogen Compatible] Flange Sealants: LOCTITE 510, LOCTITE 518, LOCTITE 574 ■ Adhesives for Preventing Screw Loosening: LOCTITE 243, etc. <Exhibitor Presentation> March 17, 2026 (Tuesday) 14:30 - 15:00 "Supporting a Hydrogen Society with 'Invisible Technology' - The Future of Hydrogen-Compatible Sealants and Adhesives" @ West 2-B (Hydrogen Energy Utilization Seminar Venue) <Henkel Japan Booth Number> W16-20 (West Hall 2) *There will be presentations within the booth and visitor benefits.

To effectively promote the use of AI in businesses, establishing a reliable data integration platform is essential. In this seminar, we will outline the strengths of Databricks, which is gaining attention as a data lakehouse platform, and explain the optimal division of roles in data integration using ASTERIA Warp. Furthermore, through a demonstration of data integration from core systems (DB) to Databricks, participants will be able to concretely experience the actual operational image. Through this seminar, we hope you will not only understand the importance of "utilizing data" but also "connecting data," and take home tips for building an optimal data integration platform. <Recommended for> ✔ Those in the information systems department considering the construction of a data utilization platform ✔ Management planning and data strategy personnel responsible for promoting DX ✔ Those considering the introduction of Databricks or those who have already implemented ASTERIA Warp and want to strengthen their analytical platform ✔ Those who want to streamline data integration and analysis in a seamless manner