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  6. Cross-edge microfabrication [glass processing] cavity/cap glass

Cross-edge microfabrication [glass processing] cavity/cap glass

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last updated:Dec 27, 2019

テクニスコ
テクニスコ
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The window section can be made thinner and more transparent. It is suitable for applications such as the transmission of laser light or LED light and observation with immersion microscopy through the window section.

High-precision cavities are formed inside the glass substrate. The window section can be made thin and transparent, allowing laser light and LED light to pass through without distortion, making it suitable for applications such as observation with an immersion microscope through the window. By shielding the glass sidewalls, unnecessary light can also be blocked. By implementing three-dimensional wiring from the bottom to the top of the glass, reliability can be improved while maintaining transparency. This also allows for a review of the assembly process, leading to space-saving solutions. 【Features】 - Transparent processing of the cavity bottom is possible - Metallization on the sidewalls is possible - Three-dimensional wiring shapes are possible *For more details, please contact us or download the catalog.

    Processing ContractSurface treatment contract serviceGlass
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Cross-edge microfabrication [glass processing] cavity/cap glass

img01.jpg
img01.jpg
  • Related Link - http://www.tecnisco.co.jp/product/glass/cap/

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Cap for CMOS sensor Observation/analysis chip Cap for LD/LED light source

Detailed information

  • img02

    Transparent processing of the cavity bottom surface is possible.

  • img02_01.jpg

    Standard cavity machining Enlarged view

  • img02_02.jpg

    Cavity - Bottom Surface Transparent Processing Enlarged View

  • img03

    Metallization on the side wall is possible.

  • img03_01.jpg

    Enlarged view

  • img03_02.jpg

    Enlarged view

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Cross-edge microfabrication [glass microfabrication] cavity/cap glass

Cross-edge microfabrication [glass microfabrication] cavity/cap glass

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Cross Edge Microfabrication Comprehensive Catalog [Latest Edition]

Cross Edge Microfabrication Comprehensive Catalog [Latest Edition]

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Technisco Technology Introduction Materials

Technisco Technology Introduction Materials

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Notice of Participation in the 20th Semiconductor and Sensor Packaging Technology Exhibition

  • Seminar・Event

This time, Technisco will be exhibiting at the "20th Semiconductor and Sensor Packaging Technology Exhibition" held at Tokyo Big Sight from January 16, 2019. [Booth Number] E26-37 (East Hall 3) *We sincerely look forward to your visit.

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Notice of Participation in Ceatec Japan 2018

  • Seminar・Event

This time, Technisco will be exhibiting at "CEATEC JAPAN 2018," which will be held at Makuhari Messe from October 16, 2018. [Booth Number] Small Package H023, Hall 5 (near the entrance) Electronic Components/Devices Zone *We sincerely look forward to your visit.

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テクニスコ

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We will propose the most suitable solutions that match our customers' requirements, considering quality, cost, and mass production, through our advanced composite processing technology (Cross Edge Micro Machining), which combines five cutting-edge techniques: cutting, grinding, polishing, metalizing, and joining.

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