The window section can be made thinner and more transparent. It is suitable for applications such as the transmission of laser light or LED light and observation with immersion microscopy through the window section.
High-precision cavities are formed inside the glass substrate. The window section can be made thin and transparent, allowing laser light and LED light to pass through without distortion, making it suitable for applications such as observation with an immersion microscope through the window. By shielding the glass sidewalls, unnecessary light can also be blocked. By implementing three-dimensional wiring from the bottom to the top of the glass, reliability can be improved while maintaining transparency. This also allows for a review of the assembly process, leading to space-saving solutions. 【Features】 - Transparent processing of the cavity bottom is possible - Metallization on the sidewalls is possible - Three-dimensional wiring shapes are possible *For more details, please contact us or download the catalog.
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For more details, please contact us or download the catalog.
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Applications/Examples of results
Cap for CMOS sensor Observation/analysis chip Cap for LD/LED light source
Detailed information
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Transparent processing of the cavity bottom surface is possible.
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Standard cavity machining Enlarged view
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Cavity - Bottom Surface Transparent Processing Enlarged View
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Metallization on the side wall is possible.
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Enlarged view
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Enlarged view
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We will propose the most suitable solutions that match our customers' requirements, considering quality, cost, and mass production, through our advanced composite processing technology (Cross Edge Micro Machining), which combines five cutting-edge techniques: cutting, grinding, polishing, metalizing, and joining.