Notice of Participation in the 20th Semiconductor and Sensor Packaging Technology Exhibition

This time, Technisco will be exhibiting at the "20th Semiconductor and Sensor Packaging Technology Exhibition" held at Tokyo Big Sight from January 16, 2019.
[Booth Number] E26-37 (East Hall 3)
*We sincerely look forward to your visit.

Date and time | Wednesday, Jan 16, 2019 ~ Friday, Jan 18, 2019 10:00 AM ~ 06:00 PM Only on the final day until 17:00. |
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Capital | Tokyo Big Sight (Tokyo International Exhibition Center) East Hall 3 3-11-1 Ariake, Koto City, Tokyo |
Entry fee | Free |
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