It can achieve anodic bonding without using adhesive, solving the outgassing problem. Compatible with wafer-level packaging (WLP).
"Small diameter hole glass" is processed using glass chipping-free processing technology. In hard glass substrates such as borosilicate glass, chipping of several tens of micrometers can easily occur on the processing surface during groove or hole processing, which poses a significant quality issue. By using Technisco's chipping-free processing technology, it is possible to keep the chipping level below 10 micrometers when using glass substrates as WLP (wafer-level packaging) along with semiconductor substrates or when dicing at the device level. Furthermore, it is possible to eliminate chipping through post-processing. 【Features】 ○ Small diameter hole processing ・Achieves a minimum diameter of 0.1 mm ○ Compatible with wafers up to 300 mm in diameter (For some processing, compatibility is up to 200 mm) ○ Suppresses burrs around the hole area ○ Reduces chipping ・Can accommodate chipping levels of ≤10 μm *For more details, please download the catalog or contact us.
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Applications/Examples of results
【Automotive】 - Various pressure sensors, various acceleration sensors, etc. - Gyro sensors, etc. 【Semiconductors】 - RF-MEMS switches, etc. - Image sensors, etc. *For more details, please feel free to contact us.
Detailed information
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Image 1 By enabling anodic bonding without the use of adhesive, the outgassing problem is resolved. Compatible with wafer-level packaging (WLP).
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Comparison of the area around the hole ■Special polished products Amount of taper Width: <10μm Depth: <0.1μm
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Special grinding products ■Standard grinding products Amount of wear Width >400μm Depth >0.7μm
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Chipping Comparison ■Special Polished Products
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Chipping Comparison ■Standard Polished Products
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We will propose the most suitable solutions that match our customers' requirements, considering quality, cost, and mass production, through our advanced composite processing technology (Cross Edge Micro Machining), which combines five cutting-edge techniques: cutting, grinding, polishing, metalizing, and joining.