We will propose the most suitable abrasive material according to your company's usage purposes.
Grinding micro powder A (fused alumina) is a representative artificial abrasive material made by melting alumina ore in an electric furnace. Grinding micro powder WA (white fused alumina) is also a representative artificial abrasive material made by melting in an electric furnace, similar to material A. Grinding micro powder KOA has fused alumina as its main component, and appears as a brown powder that is very tough. Grinding micro powder GC (green silicon carbide) is a representative artificial abrasive material made by firing quartz and coke in an electric furnace. Grinding micro powder CeO2 (cerium oxide) is a typical abrasive used for glass polishing, with various processing targets including flat glass, glass ornaments, quartz, lenses, and photomasks. ● For more details, please download the catalog or contact us.
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**Features** [Polishing Micro Powder A (Fused Alumina)] ○ A representative artificial abrasive made by melting alumina ore in an electric furnace. ○ A brown, tough artificial abrasive. [Polishing Micro Powder WA (White Fused Alumina)] ○ Similar to A material, a representative artificial abrasive made by melting in an electric furnace. ○ Commonly referred to as White Alundum, it is white and has high crushing strength and significant self-sharpening properties. [Polishing Micro Powder KOA] ○ Mainly composed of fused alumina, it appears as a brown powder and is very tough. ○ Ideal for polishing silicon wafers. [Polishing Micro Powder GC (Green Silicon Carbide)] ○ A representative artificial abrasive made by sintering silica and coke in an electric furnace. ○ Best suited for hard workpieces and those with material removal. [Polishing Micro Powder CeO2 (Cerium Oxide)] ○ A representative abrasive for glass polishing. ○ Suitable for various materials including flat glass, glass ornaments, quartz, lenses, and photomasks. ○ Available in products with an average particle size of less than 1μm to those with an average particle size of more than 10μm. ● For more details, please download the catalog or contact us.
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With the arrival of a rapidly information-oriented society, the needs of society have become more diverse, and higher functionality and quality products are being demanded across all industries. In this context, we at Technorise have not forgotten our high goal of "providing precision that exceeds standards," which has been our motto since our establishment. We have engaged in various technological developments across a range of devices and have provided products based on solid trust. Thanks to this, we have received high evaluations from customers in various fields, and we have gained significant trust for a wide array of products, including wrapping and polishing-related equipment, semiconductor-related devices, flat and spherical polishing machines, various tools, as well as silicon wafers, environmental products, and optical communication-related devices. As we enter the 21st century, expectations for ultra-high technology are increasing, and at the same time, there are still many challenges that companies will face, such as addressing environmental issues, reducing all costs, and improving business efficiency. Technorise aims to continue proposing better products and contributing to society in various ways.
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