Electrostatic measures: Process tape for electrostatic chucks - ST chuck tape

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ST Chuck Tape

last updated：Jul 21, 2021

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Electrostatic chuck for glass wafers! Excellent conductivity, chemical resistance, and heat resistance!

This is a conductive heat-resistant protective tape made from PI and PEN, which have been treated with our unique conductive processing, and uses silicone and heat-resistant acrylic adhesive. By applying it to glass wafers or glass support wafers, electrostatic chucks can be used at low voltage. It can be used with various wafers such as MEMS, CMOS, and IGBT. Additionally, due to its heat resistance of over 200°C and chemical resistance, it can also be used for wafer surface protection applications. **Features** - Can be repurposed for conventional semiconductor equipment - High transparency allows for image recognition through the film - Safe for use in plasma processes due to low outgassing and low ion contamination - The substrate and adhesive have heat and chemical resistance, making it suitable for baking and chemical cleaning For more details, please contact us or refer to the catalog.

Related Link - https://www.achilles.jp/product/electronics/esd/st…

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**Material Properties** **<Product Number: STSI-PEN#25>** Base Film: PEN Usable Temperature: Below 180℃ Surface Resistivity (Substrate Side): 1.3×10^5Ω/□ *High Resistance Meter Surface Resistivity (Adhesive Side): >1.0×10^13Ω/□ *High Resistance Meter Dissipation Time: <0.3sec. *FTM 101C-4046 (23℃×15%RH) Adhesion Strength (to Glass): 0.18N/25mm *170° Peel Test Outgassing: 34μg/g *170℃, 10min Total Light Transmittance: 75% *JIS K 7105 **<STSI-PI#25>** Base Film: PI Usable Temperature: Below 300℃ Surface Resistivity (Substrate Side): 1.3×10^5Ω/□ *High Resistance Meter Surface Resistivity (Adhesive Side): >1.0×10^13Ω/□ *High Resistance Meter Dissipation Time: <0.3sec. *FTM 101C-4046 (23℃×15%RH) Adhesion Strength (to Glass): 0.18N/25mm *170° Peel Test Outgassing: 43μg/g *170℃, 10min Total Light Transmittance: 47% *JIS K 7105

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Applications/Examples of results

Wafer protection for various semiconductor manufacturing processes such as CVD, sputtering, plasma etching, chemical etching, and baking. For electrostatic chuck applications.