High-capacity, high-speed communication equipment printed circuit board material CS-3376G
Rishoraito/CS-3376G
It was developed for mobile phone base station antenna substrates.
The substrate glass fabric uses general-purpose E-glass, which offers excellent cost performance.
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basic information
【Features】 〇 Glass fabric substrate PPE resin printed circuit board material (copper-clad laminate) 〇 Relative permittivity = 3.1 〇 Dielectric loss tangent = 0.003 〇 Glass transition temperature = 200℃ 〇 Low water absorption 〇 Excellent drillability (no prepreg for multilayer use)
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Applications/Examples of results
〇 Mobile phone base station related (antenna substrates, amplifier substrates, etc.) 〇 GPS antenna substrates 〇 Other circuit boards for electrical devices that require high-speed processing of large amounts of data Risholite PPE resin printed wiring board series has many adoption records in applications such as the above.
Detailed information
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Frequency dependence of relative permittivity It can be seen that CS-3376G achieves stable dielectric properties even as the frequency increases.
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Frequency dependence of dielectric tangent It can be seen that CS-3376G exhibits stable dielectric characteristics even as the frequency increases.
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Transmission Loss Measurement Results The frequency band used by next-generation mobile phones is expected to be the higher 3.5 gigahertz band. Higher frequency signals tend to convert some of their energy into heat as they pass through printed circuits, leading to attenuation. Therefore, antennas require substrate materials with "transmission loss characteristics," meaning they should have properties that minimize signal attenuation. CS-3376G has lower transmission loss compared to our conventional PPE materials and exhibits performance close to that of fluoropolymer substrates (PTFE).
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Drill Bit Residual Rate The tip area of the drill bit after 4000 shots was compared to the area before processing. The CS-3376G showed more than 10% less drill wear compared to the FR-4 material (CS-3355T). The drilling conditions are as follows: Sample = 0.8mm thick, 35μm double-sided copper-clad laminate Drill diameter = 0.9mm Number of laminate layers = 4 layers Number of shots = 4000 Rotational speed = 80,000rpm Chip load = 15μm/rev.
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Roughness of the inner wall of the through hole The condition of the hole wall (surface) affects the quality of the through hole plating. Results equivalent to FR-4 (CS-3355T) material were obtained.
Line up（1）
| Model number | overview |
|---|---|
| CS-3376G | Copper-clad laminate for printed circuit boards made of glass cloth base PPE resin (double-sided board) |
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Company information
The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.