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  6. High-capacity, high-speed communication equipment printed circuit board material CS-3376G

High-capacity, high-speed communication equipment printed circuit board material CS-3376G

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Rishoraito/CS-3376G

last updated:Mar 06, 2020

利昌工業
利昌工業
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It was developed for mobile phone base station antenna substrates.

The substrate glass fabric uses general-purpose E-glass, which offers excellent cost performance.

    Other polymer materials
CS-3376G.jpg

High-capacity, high-speed communication equipment printed circuit board material CS-3376G

CS-3376G.jpg
CS-3376G.jpg Dk_Hz.jpg Df_Hz.jpg 伝送損失.jpg ドリル刃残存率.jpg 内壁粗度.jpg ドリル加工.jpg
  • Special site - Product/service details - https://pr.mono.ipros.com/risho/product/

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basic information

【Features】 〇 Glass fabric substrate PPE resin printed circuit board material (copper-clad laminate) 〇 Relative permittivity = 3.1 〇 Dielectric loss tangent = 0.003 〇 Glass transition temperature = 200℃ 〇 Low water absorption 〇 Excellent drillability (no prepreg for multilayer use)

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Applications/Examples of results

〇 Mobile phone base station related (antenna substrates, amplifier substrates, etc.) 〇 GPS antenna substrates 〇 Other circuit boards for electrical devices that require high-speed processing of large amounts of data Risholite PPE resin printed wiring board series has many adoption records in applications such as the above.

Detailed information

  • Dk_Hz.jpg

    Frequency dependence of relative permittivity It can be seen that CS-3376G achieves stable dielectric properties even as the frequency increases.

  • Df_Hz.jpg

    Frequency dependence of dielectric tangent It can be seen that CS-3376G exhibits stable dielectric characteristics even as the frequency increases.

  • 伝送損失.jpg

    Transmission Loss Measurement Results The frequency band used by next-generation mobile phones is expected to be the higher 3.5 gigahertz band. Higher frequency signals tend to convert some of their energy into heat as they pass through printed circuits, leading to attenuation. Therefore, antennas require substrate materials with "transmission loss characteristics," meaning they should have properties that minimize signal attenuation. CS-3376G has lower transmission loss compared to our conventional PPE materials and exhibits performance close to that of fluoropolymer substrates (PTFE).

  • ドリル刃残存率.jpg

    Drill Bit Residual Rate The tip area of the drill bit after 4000 shots was compared to the area before processing. The CS-3376G showed more than 10% less drill wear compared to the FR-4 material (CS-3355T). The drilling conditions are as follows: Sample = 0.8mm thick, 35μm double-sided copper-clad laminate Drill diameter = 0.9mm Number of laminate layers = 4 layers Number of shots = 4000 Rotational speed = 80,000rpm Chip load = 15μm/rev.

  • 内壁粗度.jpg

    Roughness of the inner wall of the through hole The condition of the hole wall (surface) affects the quality of the through hole plating. Results equivalent to FR-4 (CS-3355T) material were obtained.

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Model number overview
CS-3376G Copper-clad laminate for printed circuit boards made of glass cloth base PPE resin (double-sided board)

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Low dielectric constant PPE resin printed circuit board material CS-3376G

Low dielectric constant PPE resin printed circuit board material CS-3376G

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利昌工業

利昌工業

Resin/Plastic

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The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.

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