Wafer Hot Chuck "PH-201C"

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last updated：Apr 22, 2014

MSAファクトリー

Official site

By replacing the top plate, it is possible to accommodate various workpieces.

The Wafer Hot Chuck "PH-201C" is compact and uniformly heats extremely thin workpieces such as wafers and glass substrates. The workpieces are fixed in place by vacuum suction, eliminating stress caused by fixation. Customization is available for size, suction patterns, and temperature. We can accommodate integration into your testing systems and provide OEM support for equipment manufacturers. 【Features】 ○ Supports a maximum temperature of 400°C ○ Top plate structure allows for compatibility with multiple types of workpieces through plate replacement ○ Precise temperature control is possible with the MSA digital temperature controller ○ A wide range of options available, including pressure gauges and vacuum switching valves ○ OEM support For more details, please contact us or download the catalog.

Related Link - http://msa-factory.co.jp/

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basic information

【Specifications】 ○ Temperature control range: Room temperature to 400℃ ○ Chuck surface size: φ6”mm ○ Temperature accuracy: ±1.5% ● For more details, please contact us or download the catalog.